Microstructural evolution of sn-ag-sb solder with indium additions

Hwa Teng Lee; Choo Yeow Lee; Fok Foo Lee; Yin Fa Chen; Yang Hsien Lee

doi:10.1007/s11664-009-0884-2

Microstructural evolution of sn-ag-sb solder with indium additions

Hwa Teng Lee, Choo Yeow Lee, Fok Foo Lee, Yin Fa Chen, Yang Hsien Lee

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag ₃(Sn,In), Ag ₂(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag ₃Sn compound were gradually replaced by In atoms, prompting a transformation from Ag ₃Sn to Ag ₃(Sn,In) and finally to Ag ₂(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag ₂(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu ₆Sn ₅ interfacial compounds in the solder/Cu joints transformed into Cu ₆(Sn,In) ₅.

Original language	English
Pages (from-to)	2112-2121
Number of pages	10
Journal	Journal of Electronic Materials
Volume	38
Issue number	10
DOIs	https://doi.org/10.1007/s11664-009-0884-2
Publication status	Published - 2009 Oct 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1007/s11664-009-0884-2

Fingerprint Dive into the research topics of 'Microstructural evolution of sn-ag-sb solder with indium additions'. Together they form a unique fingerprint.

Cite this

@article{59c78c21fdf54739bd40273c58d2fdbd,

title = "Microstructural evolution of sn-ag-sb solder with indium additions",

abstract = "The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag 3(Sn,In), Ag 2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag 3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag 3Sn to Ag 3(Sn,In) and finally to Ag 2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag 2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu 6Sn 5 interfacial compounds in the solder/Cu joints transformed into Cu 6(Sn,In) 5.",

author = "Lee, {Hwa Teng} and Lee, {Choo Yeow} and Lee, {Fok Foo} and Chen, {Yin Fa} and Lee, {Yang Hsien}",

year = "2009",

month = oct,

day = "1",

doi = "10.1007/s11664-009-0884-2",

language = "English",

volume = "38",

pages = "2112--2121",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "10",

}

TY - JOUR

T1 - Microstructural evolution of sn-ag-sb solder with indium additions

AU - Lee, Hwa Teng

AU - Lee, Choo Yeow

AU - Lee, Fok Foo

AU - Chen, Yin Fa

AU - Lee, Yang Hsien

PY - 2009/10/1

Y1 - 2009/10/1

N2 - The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag 3(Sn,In), Ag 2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag 3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag 3Sn to Ag 3(Sn,In) and finally to Ag 2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag 2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu 6Sn 5 interfacial compounds in the solder/Cu joints transformed into Cu 6(Sn,In) 5.

AB - The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag 3(Sn,In), Ag 2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag 3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag 3Sn to Ag 3(Sn,In) and finally to Ag 2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag 2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu 6Sn 5 interfacial compounds in the solder/Cu joints transformed into Cu 6(Sn,In) 5.

UR - http://www.scopus.com/inward/record.url?scp=69049111670&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=69049111670&partnerID=8YFLogxK

U2 - 10.1007/s11664-009-0884-2

DO - 10.1007/s11664-009-0884-2

M3 - Article

AN - SCOPUS:69049111670

VL - 38

SP - 2112

EP - 2121

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 10

ER -