TY - JOUR
T1 - Microstructural evolution of sn-ag-sb solder with indium additions
AU - Lee, Hwa Teng
AU - Lee, Choo Yeow
AU - Lee, Fok Foo
AU - Chen, Yin Fa
AU - Lee, Yang Hsien
N1 - Funding Information:
The authors would like to thank the National Science Council of Taiwan for the financial support of this study under Contract No. NSC 94-2216-E-006-044.
PY - 2009/10
Y1 - 2009/10
N2 - The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag 3(Sn,In), Ag 2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag 3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag 3Sn to Ag 3(Sn,In) and finally to Ag 2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag 2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu 6Sn 5 interfacial compounds in the solder/Cu joints transformed into Cu 6(Sn,In) 5.
AB - The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints were examined. The results showed that In prompts the formation of Ag 3(Sn,In), Ag 2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag 3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag 3Sn to Ag 3(Sn,In) and finally to Ag 2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag 2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu 6Sn 5 interfacial compounds in the solder/Cu joints transformed into Cu 6(Sn,In) 5.
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U2 - 10.1007/s11664-009-0884-2
DO - 10.1007/s11664-009-0884-2
M3 - Article
AN - SCOPUS:69049111670
VL - 38
SP - 2112
EP - 2121
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
SN - 0361-5235
IS - 10
ER -