Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

J. M. Song, G. F. Lan, Truan-Sheng Lui, L. H. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Mechanical properties of a potential lead-free solder, Sn-9Zn-xAg (x=0.5∼3.5 wt%), are examined in this study, particularly the vibration fatigue behavior. Results show that striated deformation of Sn-rich dendrites contributes to a greater damping capacity and thus the specimens with higher Ag content possessed a higher vibration life when suffering vibration with a constant vibration force. With respect to vibration under a fixed initial deflection amplitude, all the specimens had a similar vibration fracture resistance under low strain amplitude conditions, while high Ag specimens had a higher vibration cycles to failure under high strain conditions. This was closely related to the striated deformation along the main crack.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages276-281
Number of pages6
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

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  • Cite this

    Song, J. M., Lan, G. F., Lui, T-S., & Chen, L. H. (2002). Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 276-281). [1188850] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188850