TY - GEN
T1 - Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys
AU - Song, J. M.
AU - Lan, G. F.
AU - Lui, Truan-Sheng
AU - Chen, L. H.
PY - 2002/1/1
Y1 - 2002/1/1
N2 - Mechanical properties of a potential lead-free solder, Sn-9Zn-xAg (x=0.5∼3.5 wt%), are examined in this study, particularly the vibration fatigue behavior. Results show that striated deformation of Sn-rich dendrites contributes to a greater damping capacity and thus the specimens with higher Ag content possessed a higher vibration life when suffering vibration with a constant vibration force. With respect to vibration under a fixed initial deflection amplitude, all the specimens had a similar vibration fracture resistance under low strain amplitude conditions, while high Ag specimens had a higher vibration cycles to failure under high strain conditions. This was closely related to the striated deformation along the main crack.
AB - Mechanical properties of a potential lead-free solder, Sn-9Zn-xAg (x=0.5∼3.5 wt%), are examined in this study, particularly the vibration fatigue behavior. Results show that striated deformation of Sn-rich dendrites contributes to a greater damping capacity and thus the specimens with higher Ag content possessed a higher vibration life when suffering vibration with a constant vibration force. With respect to vibration under a fixed initial deflection amplitude, all the specimens had a similar vibration fracture resistance under low strain amplitude conditions, while high Ag specimens had a higher vibration cycles to failure under high strain conditions. This was closely related to the striated deformation along the main crack.
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U2 - 10.1109/EMAP.2002.1188850
DO - 10.1109/EMAP.2002.1188850
M3 - Conference contribution
AN - SCOPUS:84966662618
T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
SP - 276
EP - 281
BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Y2 - 4 December 2002 through 6 December 2002
ER -