Microstructure and electrical mechanism of Sn-xAg-Cu PV-ribbon for solar cells

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Dai Wen Qiu, Ta Lung Chou

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

The microstructure, fusion current, and series resistance of photovoltaic (PV) ribbon containing SAC105 and SAC305 alloys are investigated. After reflow, the interfacial microstructures of solder/Cu and solder/Ag were observed and an electrical current test was conducted to clarify the effect of the interface transition on the resistance of the structure. The area of the eutectic region of SAC305 solder is larger than that of SAC105 solder, and thus the resistance of the former is lower than latter. However, SAC105 solder has a higher fusion current density than that of SAC305 solder. After reflow, the thickness of the residual Ag film of SAC105 is smaller than that of the residual Ag film of SAC305 because of the Ag concentration gradient between SAC105 and the Ag electrode is larger. Therefore, the series resistance of a SAC105 PV ribbon structure is larger than that of a SAC305 PV ribbon structure. After the electrical current test, part of the Ag film formed Ag3Sn compounds. The Ag3Sn layer thickness increased with increasing current duration. The Ag3Sn thickness of the SAC105 PV ribbon structure is nearly equal to that of the SAC305 PV ribbon structure, but the residual Ag film (electrode) of SAC105 is smaller, which leads to higher resistance. Applying high-Ag-content solders to PV ribbon can avoid the Ag layer to be over-consuming, which can decrease series resistance.

Original languageEnglish
Pages (from-to)33-39
Number of pages7
JournalMicroelectronic Engineering
Volume116
DOIs
Publication statusPublished - 2014 Mar 25

Fingerprint

solders
Soldering alloys
ribbons
Solar cells
solar cells
microstructure
Microstructure
Fusion reactions
fusion
Electrodes
electrodes
high resistance
eutectics
Eutectics
Current density
current density
gradients

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

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title = "Microstructure and electrical mechanism of Sn-xAg-Cu PV-ribbon for solar cells",
abstract = "The microstructure, fusion current, and series resistance of photovoltaic (PV) ribbon containing SAC105 and SAC305 alloys are investigated. After reflow, the interfacial microstructures of solder/Cu and solder/Ag were observed and an electrical current test was conducted to clarify the effect of the interface transition on the resistance of the structure. The area of the eutectic region of SAC305 solder is larger than that of SAC105 solder, and thus the resistance of the former is lower than latter. However, SAC105 solder has a higher fusion current density than that of SAC305 solder. After reflow, the thickness of the residual Ag film of SAC105 is smaller than that of the residual Ag film of SAC305 because of the Ag concentration gradient between SAC105 and the Ag electrode is larger. Therefore, the series resistance of a SAC105 PV ribbon structure is larger than that of a SAC305 PV ribbon structure. After the electrical current test, part of the Ag film formed Ag3Sn compounds. The Ag3Sn layer thickness increased with increasing current duration. The Ag3Sn thickness of the SAC105 PV ribbon structure is nearly equal to that of the SAC305 PV ribbon structure, but the residual Ag film (electrode) of SAC105 is smaller, which leads to higher resistance. Applying high-Ag-content solders to PV ribbon can avoid the Ag layer to be over-consuming, which can decrease series resistance.",
author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Li Hui} and Qiu, {Dai Wen} and Chou, {Ta Lung}",
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Microstructure and electrical mechanism of Sn-xAg-Cu PV-ribbon for solar cells. / Chen, Kuan Jen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui; Qiu, Dai Wen; Chou, Ta Lung.

In: Microelectronic Engineering, Vol. 116, 25.03.2014, p. 33-39.

Research output: Contribution to journalArticle

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AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Qiu, Dai Wen

AU - Chou, Ta Lung

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AB - The microstructure, fusion current, and series resistance of photovoltaic (PV) ribbon containing SAC105 and SAC305 alloys are investigated. After reflow, the interfacial microstructures of solder/Cu and solder/Ag were observed and an electrical current test was conducted to clarify the effect of the interface transition on the resistance of the structure. The area of the eutectic region of SAC305 solder is larger than that of SAC105 solder, and thus the resistance of the former is lower than latter. However, SAC105 solder has a higher fusion current density than that of SAC305 solder. After reflow, the thickness of the residual Ag film of SAC105 is smaller than that of the residual Ag film of SAC305 because of the Ag concentration gradient between SAC105 and the Ag electrode is larger. Therefore, the series resistance of a SAC105 PV ribbon structure is larger than that of a SAC305 PV ribbon structure. After the electrical current test, part of the Ag film formed Ag3Sn compounds. The Ag3Sn layer thickness increased with increasing current duration. The Ag3Sn thickness of the SAC105 PV ribbon structure is nearly equal to that of the SAC305 PV ribbon structure, but the residual Ag film (electrode) of SAC105 is smaller, which leads to higher resistance. Applying high-Ag-content solders to PV ribbon can avoid the Ag layer to be over-consuming, which can decrease series resistance.

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