Microstructure and formation of copper oxide in the Cu electro-polishing process

Te Ming Kung, Michael Rong Shie Huang, Jung Chih Tsao, Chuan Pu Liu, Ying Lang Wang

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

In this study, the formation of Cu oxide on Cu film is studied during Cu electropolishing in a phosphoric acid-based electrolyte with various Cu ion concentrations, from 2.28% to 10.08%. In cyclic voltammetry measurement, the maximum current density of the anodic peak (l max) decreases from 38.87 to 28.13 mA/cm 2 with increasing Cu ion concentration, indicating that an oxide film forms on the Cu film surface and the thickness increases with Cu ion concentration. Microstructures and crystallography of the oxide film are examined by transmission electron microscopy, which confirms the increase of the oxide film thickness due to the high Cu ion concentration in a H 3PO 4 electrolyte. Three types of Cu oxide are detected using X-ray photoelectron spectroscopy, namely Cu 2O, Cu(OH) 2, and CuO. With a Cu-ion electrolyte concentration of less than 6.99%, Cu(OH) 2 is dominant, while at higher Cu-ion concentrations, CuO predominates. The formation of CuO protects Cu from corrosion in the electrolyte with the Cu-ion concentration of over 6.99%.

Original languageEnglish
Pages (from-to)7065-7069
Number of pages5
JournalJournal of Nanoscience and Nanotechnology
Volume10
Issue number11
DOIs
Publication statusPublished - 2010 Nov 1

Fingerprint

Copper oxides
copper oxides
ion concentration
Polishing
polishing
Oxides
Copper
Ions
microstructure
Microstructure
Electrolytes
electrolytes
oxide films
Oxide films
electropolishing
oxides
phosphoric acid
Electrolytic polishing
Photoelectron Spectroscopy
Crystallography

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Biomedical Engineering
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Kung, Te Ming ; Huang, Michael Rong Shie ; Tsao, Jung Chih ; Liu, Chuan Pu ; Wang, Ying Lang. / Microstructure and formation of copper oxide in the Cu electro-polishing process. In: Journal of Nanoscience and Nanotechnology. 2010 ; Vol. 10, No. 11. pp. 7065-7069.
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Microstructure and formation of copper oxide in the Cu electro-polishing process. / Kung, Te Ming; Huang, Michael Rong Shie; Tsao, Jung Chih; Liu, Chuan Pu; Wang, Ying Lang.

In: Journal of Nanoscience and Nanotechnology, Vol. 10, No. 11, 01.11.2010, p. 7065-7069.

Research output: Contribution to journalArticle

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N2 - In this study, the formation of Cu oxide on Cu film is studied during Cu electropolishing in a phosphoric acid-based electrolyte with various Cu ion concentrations, from 2.28% to 10.08%. In cyclic voltammetry measurement, the maximum current density of the anodic peak (l max) decreases from 38.87 to 28.13 mA/cm 2 with increasing Cu ion concentration, indicating that an oxide film forms on the Cu film surface and the thickness increases with Cu ion concentration. Microstructures and crystallography of the oxide film are examined by transmission electron microscopy, which confirms the increase of the oxide film thickness due to the high Cu ion concentration in a H 3PO 4 electrolyte. Three types of Cu oxide are detected using X-ray photoelectron spectroscopy, namely Cu 2O, Cu(OH) 2, and CuO. With a Cu-ion electrolyte concentration of less than 6.99%, Cu(OH) 2 is dominant, while at higher Cu-ion concentrations, CuO predominates. The formation of CuO protects Cu from corrosion in the electrolyte with the Cu-ion concentration of over 6.99%.

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