Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders

Nai Shuo Liu; Kwang Lung Lin

doi:10.1016/j.scriptamat.2004.10.033

Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders

Nai Shuo Liu, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

The Sn-8.5Zn-0.5Ag-0.1Al-xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.

Original language	English
Pages (from-to)	369-374
Number of pages	6
Journal	Scripta Materialia
Volume	52
Issue number	5
DOIs	https://doi.org/10.1016/j.scriptamat.2004.10.033
Publication status	Published - 2005 Aug 1

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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10.1016/j.scriptamat.2004.10.033

Cite this

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title = "Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders",

abstract = "The Sn-8.5Zn-0.5Ag-0.1Al-xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.",

author = "Liu, {Nai Shuo} and Lin, {Kwang Lung}",

note = "Funding Information: The financial support of this work from the National Science Council of the Republic of China under the project NSC-91-2216-E006-056 is gratefully acknowledged. ",

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AU - Liu, Nai Shuo

AU - Lin, Kwang Lung

N1 - Funding Information: The financial support of this work from the National Science Council of the Republic of China under the project NSC-91-2216-E006-056 is gratefully acknowledged.

PY - 2005/8/1

Y1 - 2005/8/1

N2 - The Sn-8.5Zn-0.5Ag-0.1Al-xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.

AB - The Sn-8.5Zn-0.5Ag-0.1Al-xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.

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Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders

Abstract

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