Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys

J. M. Song, G. F. Lan, T. S. Lui, L. H. Chen

Research output: Contribution to journalArticlepeer-review

92 Citations (Scopus)


Microstructural features and tensile properties of Sn-Zn eutectic alloys with varying Ag content were examined in this study. Results indicate that the main effects of Ag addition were reduced strength and greater ductility due to the differences in the morphology and distribution of second phase particles. Also, a modified structure caused by rapid solidification resulted in better tensile properties.

Original languageEnglish
Pages (from-to)1047-1051
Number of pages5
JournalScripta Materialia
Issue number8
Publication statusPublished - 2003 Apr 14

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


Dive into the research topics of 'Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys'. Together they form a unique fingerprint.

Cite this