Microstructure and Thermal Behavior of Sn-Zn-Ag Solders

Kwang-Lung Lin, Chia Ling Shih

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73-9% Zn and 0-3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%.

Original languageEnglish
Pages (from-to)1496-1500
Number of pages5
JournalJournal of Electronic Materials
Volume32
Issue number12
DOIs
Publication statusPublished - 2003 Jan 2

Fingerprint

solders
Soldering alloys
microstructure
Microstructure
Differential scanning calorimetry
heat measurement
scanning
solidus
liquidus
dendrites
eutectics
Eutectics
X ray diffraction analysis
Hot Temperature
Temperature
Scanning electron microscopy
scanning electron microscopy
temperature
diffraction
x rays

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Lin, Kwang-Lung ; Shih, Chia Ling. / Microstructure and Thermal Behavior of Sn-Zn-Ag Solders. In: Journal of Electronic Materials. 2003 ; Vol. 32, No. 12. pp. 1496-1500.
@article{13b1ea6a6a9646b7877dfe37de4edea6,
title = "Microstructure and Thermal Behavior of Sn-Zn-Ag Solders",
abstract = "The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73-9{\%} Zn and 0-3.0{\%} Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1{\%} Ag. X-ray diffraction (XRD) analysis results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3{\%} and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5{\%}. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0{\%} to 3.0{\%}.",
author = "Kwang-Lung Lin and Shih, {Chia Ling}",
year = "2003",
month = "1",
day = "2",
doi = "10.1007/s11664-003-0120-4",
language = "English",
volume = "32",
pages = "1496--1500",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "12",

}

Microstructure and Thermal Behavior of Sn-Zn-Ag Solders. / Lin, Kwang-Lung; Shih, Chia Ling.

In: Journal of Electronic Materials, Vol. 32, No. 12, 02.01.2003, p. 1496-1500.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Microstructure and Thermal Behavior of Sn-Zn-Ag Solders

AU - Lin, Kwang-Lung

AU - Shih, Chia Ling

PY - 2003/1/2

Y1 - 2003/1/2

N2 - The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73-9% Zn and 0-3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%.

AB - The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73-9% Zn and 0-3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%.

UR - http://www.scopus.com/inward/record.url?scp=0942266960&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0942266960&partnerID=8YFLogxK

U2 - 10.1007/s11664-003-0120-4

DO - 10.1007/s11664-003-0120-4

M3 - Article

VL - 32

SP - 1496

EP - 1500

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -