Microstructure and Thermal Behavior of Sn-Zn-Ag Solders

Kwang Lung Lin, Chia Ling Shih

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73-9% Zn and 0-3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%.

Original languageEnglish
Pages (from-to)1496-1500
Number of pages5
JournalJournal of Electronic Materials
Volume32
Issue number12
DOIs
Publication statusPublished - 2003 Jan 2

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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