Microstructure development of mechanical-deformation-induced Sn whiskers

Shih Kang Lin, Yuhi Yorikado, Junxiang Jiang, Keun Soo Kim, Katsuaki Suganuma, Sinn Wen Chen, Masanobu Tsujimoto, Isamu Yanada

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)

Abstract

The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO 2 ball indenter under ambient conditions. After compression, tin whiskers and small nodules were found adjacent to, and several grains further away from, the indents. The cross-sectional microstructures of the indents and whiskers indicate that the lateral boundaries of the newly created grains caused by recrystallization are the main routes for stress relaxation.

Original languageEnglish
Pages (from-to)1732-1734
Number of pages3
JournalJournal of Electronic Materials
Volume36
Issue number12
DOIs
Publication statusPublished - 2007 Dec

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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