Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen

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16 Citations (Scopus)


Compared with gold wire, silver wire is cheaper and enjoys better electrical conductivity. These days copper wire is becoming more commonly used, but the reliability of its bonding still has problems in some pads. Since Ag wires have similar hardness and bonding properties to Au wires, they can be applied in some pads. In the present study, the annealing effect (at 225-275 °C for 30 min) on the tensile mechanical properties of silver wires with φ = 23 μm was investigated. In addition, the microstructural characteristics and the mechanical properties before and after an electric flame-off (EFO) process were also studied. Experimental results indicate that with annealing temperatures of more than 250 °C, the silver wires possessed a fully annealed structure, the tensile strength and the hardness decreased, and the elongation was raised significantly. Through recrystallization, the matrix structure transformed from long-thin grains to equiaxed grains. The microstructure of the free air ball (FAB) of the various annealed wires after an EFO process were column-like grains. The column-like grains grew from the heat-affected zone (HAZ) to the Ag ball. Under the thermal effect of EFO, the necks of the Ag balls underwent recrystallization and grain growth was induced, and the annealed Ag wires had a shorter zone of HAZ (220 μm). Additionally, the decreased hardness and the low strength of the HAZ resulted in the breakage sites of the EFO wires being in the HAZ near the Ag balls. The bonding strength and the neck-strength of the Ag wires were more than 7gf and possessed excellent bonding properties.

Original languageEnglish
Pages (from-to)2243-2249
Number of pages7
JournalMicroelectronics Reliability
Issue number12
Publication statusPublished - 2011 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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