TY - JOUR
T1 - Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wire
AU - Hsueh, Hao Wen
AU - Hung, Fei Yi
AU - Lui, Truan Sheng
AU - Chen, Li Hui
AU - Chang, Jun Kai
N1 - Funding Information:
The authors are grateful to the Instrument Center of National Cheng Kung University and to the National Science Council of Taiwan for financially supporting this research under Grant NSC 102-2221-E-006-061 .
Publisher Copyright:
© 2014 Elsevier Ltd.
PY - 2014/11/1
Y1 - 2014/11/1
N2 - Silver has potential for application in the electronic packaging industry because of its great electrical and thermal properties and lower price compared to that of gold. Silver oxidizes easily, so doping lanthanum to form Ag-La alloy improves its anti-oxidation capacity. In this study, the microstructure, tensile properties, electronic flame-off (EFO) characteristics, and fusing current of Ag-La alloy wire (φ = 20 μm) are studied. Samples annealed at three temperatures (325 °C, 375 °C, and 425 °C) are analyzed. According to the experimental results, after annealing at 425 °C, Ag-La alloy wire recrystallized, giving it a tensile strength similar to that of pure silver wire and a uniform structure. Doping lanthanum reduced the diameter of free air balls (FABs) in the EFO process. The fusing current of Ag-La wire was about 0.45 A, and the grains of Ag-La wire grew to the size of the wire diameter when a 0.4 A current (90% fusing current) was applied for a long time. Ag-La alloy wire can be used in the electronic packaging industry.
AB - Silver has potential for application in the electronic packaging industry because of its great electrical and thermal properties and lower price compared to that of gold. Silver oxidizes easily, so doping lanthanum to form Ag-La alloy improves its anti-oxidation capacity. In this study, the microstructure, tensile properties, electronic flame-off (EFO) characteristics, and fusing current of Ag-La alloy wire (φ = 20 μm) are studied. Samples annealed at three temperatures (325 °C, 375 °C, and 425 °C) are analyzed. According to the experimental results, after annealing at 425 °C, Ag-La alloy wire recrystallized, giving it a tensile strength similar to that of pure silver wire and a uniform structure. Doping lanthanum reduced the diameter of free air balls (FABs) in the EFO process. The fusing current of Ag-La wire was about 0.45 A, and the grains of Ag-La wire grew to the size of the wire diameter when a 0.4 A current (90% fusing current) was applied for a long time. Ag-La alloy wire can be used in the electronic packaging industry.
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U2 - 10.1016/j.microrel.2014.06.004
DO - 10.1016/j.microrel.2014.06.004
M3 - Article
AN - SCOPUS:84919571592
SN - 0026-2714
VL - 54
SP - 2564
EP - 2569
JO - Microelectronics Reliability
JF - Microelectronics Reliability
IS - 11
ER -