Microstructure evolution and hardening mechanisms of Ni-P electrodeposits

Hsien Chung Huang, Sung Ting Chung, Szu Jung Pan, Wen Ta Tsai, Chao Sung Lin

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45 Citations (Scopus)

Abstract

Ni-P alloy coatings with different phosphorus contents were prepared by electroplating in a nickel sulfate bath containing phosphorous acid (H3PO3). Hardening mechanism, such as dispersion hardening of Ni nano crystals in amorphous matrix of the as-deposited Ni-P coating and coarsening weakening of Ni3P for the high P coating after 1h of heat treatment at 400°C were concluded from the experimental data. Hardening mechanism of Ni-P alloys were further discussed based on the microstructure evolution with increasing deposit P content and during the heat treatment by using high resolution TEM (HR-TEM). A maximum hardness was observed for the as-deposited and heat-treated Ni-P alloys with 4wt% and 6wt% P, respectively. These composition ranges corresponding to the microstructure with high hardness proposed are believed to be useful for the industrial applications and further study.

Original languageEnglish
Pages (from-to)2097-2103
Number of pages7
JournalSurface and Coatings Technology
Volume205
Issue number7
DOIs
Publication statusPublished - 2010 Dec 25

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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