Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test

Y. L. Huang; K. L. Lin; D. S. Liu

doi:10.1557/jmr.2010.0162

Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test

Y. L. Huang, K. L. Lin, D. S. Liu

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

Original language	English
Pages (from-to)	1312-1320
Number of pages	9
Journal	Journal of Materials Research
Volume	25
Issue number	7
DOIs	https://doi.org/10.1557/jmr.2010.0162
Publication status	Published - 2010 Jul 1

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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abstract = "The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.",

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