TY - JOUR
T1 - Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test
AU - Huang, Y. L.
AU - Lin, K. L.
AU - Liu, D. S.
N1 - Funding Information:
The authors acknowledge financial support from the National Science Council of the Republic of China (Taiwan) under Grant No. NSC-95-2221-E-006-032-MY3. The supply of solder balls from SENJU Metal Industry Co., Ltd., and substrates from ASE are also gratefully appreciated.
PY - 2010/7
Y1 - 2010/7
N2 - The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.
AB - The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.
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U2 - 10.1557/jmr.2010.0162
DO - 10.1557/jmr.2010.0162
M3 - Article
AN - SCOPUS:77957941138
VL - 25
SP - 1312
EP - 1320
JO - Journal of Materials Research
JF - Journal of Materials Research
SN - 0884-2914
IS - 7
ER -