TY - JOUR
T1 - Microstructures and mechanical properties of Sn-8.55Zn-0.45Al-XAg solders
AU - Huang, Chia Wei
AU - Lin, Kwang Lung
N1 - Funding Information:
Financial support of this work from the National Science Council of the Republic of China under Grant Nos. NSC 89-2811-E-006-0058 and NSC 89-2216-E-006-075 is gratefully acknowledged.
PY - 2003/7
Y1 - 2003/7
N2 - The microstructure, melting point, and mechanical properties of Sn-8.55Zn-0.45Al-XAg lead-free solders were investigated. The Ag content of the solders investigated was 0-3 wt.%. The results indicate that the AgZn3 and Ag5Zn8 compounds are formed at the addition of Ag to Sn-8.55Zn-0.45Al solders. The adding of Ag also results in the formation of hypoeutectic structure, increasing the melting point of the solders and decreasing the ductility. Results of thermal analysis reveal that the Sn-8.55Zn-0.45Al-XAg solder has eutectic temperature at 198°C when the addition of Ag is 0.5 wt.%. The eutectic solder exhibits greater tensile strength and higher ductility than the 63-Sn-37Pb solder.
AB - The microstructure, melting point, and mechanical properties of Sn-8.55Zn-0.45Al-XAg lead-free solders were investigated. The Ag content of the solders investigated was 0-3 wt.%. The results indicate that the AgZn3 and Ag5Zn8 compounds are formed at the addition of Ag to Sn-8.55Zn-0.45Al solders. The adding of Ag also results in the formation of hypoeutectic structure, increasing the melting point of the solders and decreasing the ductility. Results of thermal analysis reveal that the Sn-8.55Zn-0.45Al-XAg solder has eutectic temperature at 198°C when the addition of Ag is 0.5 wt.%. The eutectic solder exhibits greater tensile strength and higher ductility than the 63-Sn-37Pb solder.
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U2 - 10.1557/JMR.2003.0211
DO - 10.1557/JMR.2003.0211
M3 - Article
AN - SCOPUS:0043199518
SN - 0884-2914
VL - 18
SP - 1528
EP - 1534
JO - Journal of Materials Research
JF - Journal of Materials Research
IS - 7
ER -