Miniaturization design of backside-via structures underneath collector-Up HBTs using a 3-D finite-element model

H. C. Tseng, P. H. Lee, Jung-Hua Chou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To carry out the miniaturization design of backside-via packaging structures underneath collector-up HBTs, a 3-D finite-element model has been developed for analyzing temperature-distribution phenomena within the configurations. The results are demonstrated on the three-finger InGaP/GaAs collector-up HBT. Compared to previous reports, backside-via structures can be further reduced by 42% while maintaining the same heat-dissipation performance.

Original languageEnglish
Title of host publicationProceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
DOIs
Publication statusPublished - 2008
Event2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 - Pudong, Shanghai, China
Duration: 2008 Jul 282008 Jul 31

Other

Other2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
CountryChina
CityPudong, Shanghai
Period08-07-2808-07-31

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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