Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations

S. Venugopalan; Y. S. Chauhan; D. D. Lu; M. A. Karim; Ali M. Niknejad; Chenming Hu

doi:10.1109/NVMTS.2011.6137100

Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations

S. Venugopalan, Y. S. Chauhan, D. D. Lu, M. A. Karim, Ali M. Niknejad, Chenming Hu

Institute of Microelectronics

Research output: Contribution to conference › Paper › peer-review

2 Citations (Scopus)

Abstract

In a vertical cylindrical gate transistor, we identify doping gradation along channel and structural difference in electrode regions as major reasons for highly asymmetric drain current characteristics. These effects have been captured in a physical manner in a SPICE model. Calibration results of such a model to silicon device data from a vertical cylindrical gate technology that exhibits asymmetric I-V characteristics is presented for the first time.

Original language	English
Pages	125-128
Number of pages	4
DOIs	https://doi.org/10.1109/NVMTS.2011.6137100
Publication status	Published - 2011
Event	2011 11th Annual Non-Volatile Memory Technology Symposium, NVMTS 2011 - Shanghai, China Duration: 2011 Nov 7 → 2011 Nov 9

Other

Other	2011 11th Annual Non-Volatile Memory Technology Symposium, NVMTS 2011
Country/Territory	China
City	Shanghai
Period	11-11-07 → 11-11-09

All Science Journal Classification (ASJC) codes

Hardware and Architecture

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10.1109/NVMTS.2011.6137100

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title = "Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations",

abstract = "In a vertical cylindrical gate transistor, we identify doping gradation along channel and structural difference in electrode regions as major reasons for highly asymmetric drain current characteristics. These effects have been captured in a physical manner in a SPICE model. Calibration results of such a model to silicon device data from a vertical cylindrical gate technology that exhibits asymmetric I-V characteristics is presented for the first time.",

author = "S. Venugopalan and Chauhan, {Y. S.} and Lu, {D. D.} and Karim, {M. A.} and Niknejad, {Ali M.} and Chenming Hu",

year = "2011",

doi = "10.1109/NVMTS.2011.6137100",

language = "English",

pages = "125--128",

note = "2011 11th Annual Non-Volatile Memory Technology Symposium, NVMTS 2011 ; Conference date: 07-11-2011 Through 09-11-2011",

}

Venugopalan, S, Chauhan, YS, Lu, DD, Karim, MA, Niknejad, AM & Hu, C 2011, 'Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations', Paper presented at 2011 11th Annual Non-Volatile Memory Technology Symposium, NVMTS 2011, Shanghai, China, 11-11-07 - 11-11-09 pp. 125-128. https://doi.org/10.1109/NVMTS.2011.6137100

TY - CONF

T1 - Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations

AU - Venugopalan, S.

AU - Chauhan, Y. S.

AU - Lu, D. D.

AU - Karim, M. A.

AU - Niknejad, Ali M.

AU - Hu, Chenming

PY - 2011

Y1 - 2011

N2 - In a vertical cylindrical gate transistor, we identify doping gradation along channel and structural difference in electrode regions as major reasons for highly asymmetric drain current characteristics. These effects have been captured in a physical manner in a SPICE model. Calibration results of such a model to silicon device data from a vertical cylindrical gate technology that exhibits asymmetric I-V characteristics is presented for the first time.

AB - In a vertical cylindrical gate transistor, we identify doping gradation along channel and structural difference in electrode regions as major reasons for highly asymmetric drain current characteristics. These effects have been captured in a physical manner in a SPICE model. Calibration results of such a model to silicon device data from a vertical cylindrical gate technology that exhibits asymmetric I-V characteristics is presented for the first time.

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U2 - 10.1109/NVMTS.2011.6137100

DO - 10.1109/NVMTS.2011.6137100

M3 - Paper

AN - SCOPUS:84857157211

SP - 125

EP - 128

T2 - 2011 11th Annual Non-Volatile Memory Technology Symposium, NVMTS 2011

Y2 - 7 November 2011 through 9 November 2011

ER -

Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations

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