Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation

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13 Citations (Scopus)

Abstract

The viscosity of the underfill encapsulant may be different under the conditions of different shear rate, filler content, and temperature. Most of the encapsulant is epoxy containing silica fillers. It exhibits non-Newtonian behavior in the underfill flow. The effect of the viscosity variations on the underfill filling flow was investigated in this study. An analytical model of the filling flow is proposed to accomplish the shear-rate depending viscosity. Due to the addition of fillers in the encapsulant, the viscosity may exhibit both shear thinning and thickening behaviors depending on the temperature and filler content. This study proposes a model of the viscosity considering both effects. In the situations demonstrated in the results, the shear thinning and thickening effects may have major influence on the velocity profile and the filling speed.

Original languageEnglish
Pages (from-to)995-999
Number of pages5
JournalMicroelectronics Reliability
Volume50
Issue number7
DOIs
Publication statusPublished - 2010 Jul

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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