Abstract
In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
| Original language | English |
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| Title of host publication | 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 |
| Publication status | Published - 2013 Sep 2 |
| Event | 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 - Barcelona, Spain Duration: 2013 Apr 16 → 2013 Apr 18 |
Publication series
| Name | 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 |
|---|
Other
| Other | 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 |
|---|---|
| Country | Spain |
| City | Barcelona |
| Period | 13-04-16 → 13-04-18 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
Cite this
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Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods. / Chen, Kuo-Shen; Wu, Shang Lun.
2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 2013. 6559453 (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods
AU - Chen, Kuo-Shen
AU - Wu, Shang Lun
PY - 2013/9/2
Y1 - 2013/9/2
N2 - In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
AB - In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
UR - http://www.scopus.com/inward/record.url?scp=84883105446&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84883105446&partnerID=8YFLogxK
M3 - Conference contribution
SN - 9781467344777
T3 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
BT - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
ER -