Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods

Kuo-Shen Chen, Shang Lun Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.

Original languageEnglish
Title of host publication2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
Publication statusPublished - 2013 Sep 2
Event2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 - Barcelona, Spain
Duration: 2013 Apr 162013 Apr 18

Publication series

Name2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013

Other

Other2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
CountrySpain
CityBarcelona
Period13-04-1613-04-18

Fingerprint

Chemical mechanical polishing
Cellular automata
Structural integrity
Polishing
Mechanics

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture

Cite this

Chen, K-S., & Wu, S. L. (2013). Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods. In 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 [6559453] (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).
Chen, Kuo-Shen ; Wu, Shang Lun. / Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods. 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 2013. (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).
@inproceedings{b35c40ffb584426992e7f544bce4f44b,
title = "Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods",
abstract = "In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.",
author = "Kuo-Shen Chen and Wu, {Shang Lun}",
year = "2013",
month = "9",
day = "2",
language = "English",
isbn = "9781467344777",
series = "2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013",
booktitle = "2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013",

}

Chen, K-S & Wu, SL 2013, Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods. in 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013., 6559453, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013, Barcelona, Spain, 13-04-16.

Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods. / Chen, Kuo-Shen; Wu, Shang Lun.

2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 2013. 6559453 (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods

AU - Chen, Kuo-Shen

AU - Wu, Shang Lun

PY - 2013/9/2

Y1 - 2013/9/2

N2 - In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.

AB - In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.

UR - http://www.scopus.com/inward/record.url?scp=84883105446&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883105446&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781467344777

T3 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013

BT - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013

ER -

Chen K-S, Wu SL. Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods. In 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 2013. 6559453. (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).