TY - GEN
T1 - Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods
AU - Chen, Kuo Shen
AU - Wu, Shang Lun
PY - 2013/9/2
Y1 - 2013/9/2
N2 - In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
AB - In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
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M3 - Conference contribution
AN - SCOPUS:84883105446
SN - 9781467344777
T3 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
BT - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
T2 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
Y2 - 16 April 2013 through 18 April 2013
ER -