TY - JOUR
T1 - Modeling of chemical mechanical polishing processes by cellular automata and finite element/matlab integration methods
AU - Chen, Kuo Shen
AU - Wu, Shang Lun
AU - Yeh, Hsiu Ming
N1 - Funding Information:
This work is supported by National Science Council of Taiwan under contract No. NSC-99-2221-E-006-173-MY2. Discussions and technical support from Dr. K.-S. Ou of NCKU is also greatly appreciated.
Publisher Copyright:
© 2014, Springer-Verlag Berlin Heidelberg.
PY - 2015/9/21
Y1 - 2015/9/21
N2 - In this work, novel chemical-mechanical polishing modeling schemes for addressing the mechanical aspect in both wafer and device levels are analyzed and realized. The cellular automata method, based on Preston equation or other equivalent material removing relations and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
AB - In this work, novel chemical-mechanical polishing modeling schemes for addressing the mechanical aspect in both wafer and device levels are analyzed and realized. The cellular automata method, based on Preston equation or other equivalent material removing relations and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
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U2 - 10.1007/s00542-014-2302-9
DO - 10.1007/s00542-014-2302-9
M3 - Article
AN - SCOPUS:84939502620
VL - 21
SP - 1879
EP - 1892
JO - Microsystem Technologies
JF - Microsystem Technologies
SN - 0946-7076
IS - 9
ER -