In this work, novel chemical-mechanical polishing modeling schemes for addressing the mechanical aspect in both wafer and device levels are analyzed and realized. The cellular automata method, based on Preston equation or other equivalent material removing relations and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering