Abstract
In this work, novel chemical-mechanical polishing modeling schemes for addressing the mechanical aspect in both wafer and device levels are analyzed and realized. The cellular automata method, based on Preston equation or other equivalent material removing relations and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
| Original language | English |
|---|---|
| Pages (from-to) | 1879-1892 |
| Number of pages | 14 |
| Journal | Microsystem Technologies |
| Volume | 21 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - 2015 Sep 21 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering
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Modeling of chemical mechanical polishing processes by cellular automata and finite element/matlab integration methods. / Chen, Kuo-Shen; Wu, Shang Lun; Yeh, Hsiu Ming.
In: Microsystem Technologies, Vol. 21, No. 9, 21.09.2015, p. 1879-1892.Research output: Contribution to journal › Article
TY - JOUR
T1 - Modeling of chemical mechanical polishing processes by cellular automata and finite element/matlab integration methods
AU - Chen, Kuo-Shen
AU - Wu, Shang Lun
AU - Yeh, Hsiu Ming
PY - 2015/9/21
Y1 - 2015/9/21
N2 - In this work, novel chemical-mechanical polishing modeling schemes for addressing the mechanical aspect in both wafer and device levels are analyzed and realized. The cellular automata method, based on Preston equation or other equivalent material removing relations and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
AB - In this work, novel chemical-mechanical polishing modeling schemes for addressing the mechanical aspect in both wafer and device levels are analyzed and realized. The cellular automata method, based on Preston equation or other equivalent material removing relations and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.
UR - http://www.scopus.com/inward/record.url?scp=84939502620&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84939502620&partnerID=8YFLogxK
U2 - 10.1007/s00542-014-2302-9
DO - 10.1007/s00542-014-2302-9
M3 - Article
VL - 21
SP - 1879
EP - 1892
JO - Microsystem Technologies
JF - Microsystem Technologies
SN - 0946-7076
IS - 9
ER -