Abstract
The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (a C), was obtained. Considered with the WLF equation, which defines the temperature shift factor (a T), the total shift factor was proposed as the product of a T and a C. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined.
| Original language | English |
|---|---|
| Article number | 6036160 |
| Pages (from-to) | 1755-1760 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 1 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 2011 Nov 1 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
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Modeling of viscoelastic behavior of an epoxy molding compound during and after curing. / Lin, Yeong Jyh; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn Yuan.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 11, 6036160, 01.11.2011, p. 1755-1760.Research output: Contribution to journal › Article
TY - JOUR
T1 - Modeling of viscoelastic behavior of an epoxy molding compound during and after curing
AU - Lin, Yeong Jyh
AU - Hwang, Sheng-Jye
AU - Lee, Huei-Huang
AU - Huang, Durn Yuan
PY - 2011/11/1
Y1 - 2011/11/1
N2 - The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (a C), was obtained. Considered with the WLF equation, which defines the temperature shift factor (a T), the total shift factor was proposed as the product of a T and a C. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined.
AB - The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (a C), was obtained. Considered with the WLF equation, which defines the temperature shift factor (a T), the total shift factor was proposed as the product of a T and a C. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined.
UR - http://www.scopus.com/inward/record.url?scp=84859091388&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84859091388&partnerID=8YFLogxK
U2 - 10.1109/TCPMT.2011.2165339
DO - 10.1109/TCPMT.2011.2165339
M3 - Article
VL - 1
SP - 1755
EP - 1760
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN - 2156-3950
IS - 11
M1 - 6036160
ER -