Modeling of viscoelastic behavior of an epoxy molding compound during and after curing

Yeong Jyh Lin; Sheng Jye Hwang; Huei Huang Lee; Durn Yuan Huang

doi:10.1109/TCPMT.2011.2165339

Modeling of viscoelastic behavior of an epoxy molding compound during and after curing

Yeong Jyh Lin, Sheng Jye Hwang, Huei Huang Lee, Durn Yuan Huang

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (a _C), was obtained. Considered with the WLF equation, which defines the temperature shift factor (a _T), the total shift factor was proposed as the product of a _T and a _C. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined.

Original language	English
Article number	6036160
Pages (from-to)	1755-1760
Number of pages	6
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	1
Issue number	11
DOIs	https://doi.org/10.1109/TCPMT.2011.2165339
Publication status	Published - 2011 Nov 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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abstract = "The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (a C), was obtained. Considered with the WLF equation, which defines the temperature shift factor (a T), the total shift factor was proposed as the product of a T and a C. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined.",

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AU - Huang, Durn Yuan

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