Modeling of viscoelastic behavior of an epoxy molding compound during and after curing

Yeong Jyh Lin, Sheng-Jye Hwang, Huei-Huang Lee, Durn Yuan Huang

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (a C), was obtained. Considered with the WLF equation, which defines the temperature shift factor (a T), the total shift factor was proposed as the product of a T and a C. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined.

Original languageEnglish
Article number6036160
Pages (from-to)1755-1760
Number of pages6
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume1
Issue number11
DOIs
Publication statusPublished - 2011 Nov 1

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Sheet molding compounds
Curing
Temperature
Elastic moduli

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

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Modeling of viscoelastic behavior of an epoxy molding compound during and after curing. / Lin, Yeong Jyh; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn Yuan.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 11, 6036160, 01.11.2011, p. 1755-1760.

Research output: Contribution to journalArticle

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