Modular-Addit ion Signature Analysis for Built-in Self-Test

H.-S. Chen, Cheng-Wen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)
Original languageEnglish
Title of host publicationEuropean Test Conference (ETC)
Place of PublicationRotterdam
Pages457-465
Publication statusPublished - 1993 Apr

Cite this

Chen, H-S., & Wu, C-W. (1993). Modular-Addit ion Signature Analysis for Built-in Self-Test. In European Test Conference (ETC) (pp. 457-465).