Mold adhesion force measurement

Huei-Huang Lee, Sheng-Jye Hwang, Durn Yuan Huang, Yeong Jyh Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

During the encapsulation process of IC packages, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between EMC and mold surface. Adhesion effects can cause many problems. For example, too large an adhesion force may damage an IC during ejection and cause the package to fail and thus lower the yield rate and reliability. To get rid of the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Applying suitable surface coating is a more popular and practical approach. How to evaluate the mold adhesion force and use the data to improve products yield rate are the main issues for packaging. This paper uses a semi-automatic EMC adhesion force test instrument that had been developed and fabricated to measure normal and shear adhesion forces between the mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. Nine kinds of various mold surface coating were tested with this instrument to measure the magnitude of adhesion force between EMC to determine the effectiveness of mold coating. The measured data showed that with different coatings on mold surface, the mold adhesion force can be very different. This paper also discussed the issue of successive normal force test. Engineers would use the most effective mold coating material to execute the continuous normal adhesion experiment. The variation of normal force during successive molding test could be used to predict the time for mold cleaning. By counting the total number of shots when the normal force begins to rise, engineers can accurately predict the number of shots for a specific kind of mold surface coating to be cleaned. This paper also described the effects of defrosting period on mold adhesion force of EMC. Defrosting is a process to increase the frozen EMC temperature to room temperature and stay at room temperature for some time before molding. It was found by molding engineers that increased defrosting time period would increase the frequency of mold cleaning. But there had been no quantitative description on how much mold adhesion force increase during the defrosting process. A semi-automatic EMC adhesion force test instrument was used to evaluate the effects of defrosting period on mold adhesion force of EMC. It was found that increase the defrosting time will increase the amount of adhesion force between EMC and mold surface. The higher is the relative humidity during defrosting on the adhesion force, the higher is the increase of adhesion force.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages51-58
Number of pages8
DOIs
Publication statusPublished - 2007 Dec 1
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 2007 Jul 82007 Jul 12

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume1

Other

OtherASME Electronic and Photonics Packaging Division
CountryUnited States
CityVancouver, BC
Period07-07-0807-07-12

Fingerprint

Force measurement
Adhesion
Sheet molding compounds
Defrosting
Coatings
Molding
Engineers
Surface treatment
Cleaning

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

Cite this

Lee, H-H., Hwang, S-J., Huang, D. Y., & Lin, Y. J. (2007). Mold adhesion force measurement. In 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 (pp. 51-58). (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; Vol. 1). https://doi.org/10.1115/IPACK2007-33826
Lee, Huei-Huang ; Hwang, Sheng-Jye ; Huang, Durn Yuan ; Lin, Yeong Jyh. / Mold adhesion force measurement. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. 2007. pp. 51-58 (2007 Proceedings of the ASME InterPack Conference, IPACK 2007).
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Lee, H-H, Hwang, S-J, Huang, DY & Lin, YJ 2007, Mold adhesion force measurement. in 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, vol. 1, pp. 51-58, ASME Electronic and Photonics Packaging Division, Vancouver, BC, United States, 07-07-08. https://doi.org/10.1115/IPACK2007-33826

Mold adhesion force measurement. / Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn Yuan; Lin, Yeong Jyh.

2007 Proceedings of the ASME InterPack Conference, IPACK 2007. 2007. p. 51-58 (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; Vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lee H-H, Hwang S-J, Huang DY, Lin YJ. Mold adhesion force measurement. In 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. 2007. p. 51-58. (2007 Proceedings of the ASME InterPack Conference, IPACK 2007). https://doi.org/10.1115/IPACK2007-33826