Molded underfill for flip chip package

Yu Kai Chen, Guo Tsai Wu, Sheng-Jye Hwang, Huei-Huang Lee, Durn Yuan Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Air trap (Void) in a molded underfill package always exists. It is an annoying problem and needs further investigation. In this research, the mold filing phenomenon of molded underfill (MUF) was investigated through numerical method. The carrier was a flip chip (FC) package. Moldex3D software was used as the tool. The resin was modeled as a reaction fluid. Cure kinetics and viscosity was measured and modeled. Kamal's model was used for the cure kinetics. Castro Macosko's model was used for the viscosity model. The simulation results were compared with the experiment results and were found the short shot simulation results agreed well with the experiments. The simulation results also showed that the locations of the air trap (void) for each package could be accurately predicted if the simulation was well setup. The size of trapped air voids could also be well predicted if Boyle's Law was used as the constitutive model for the compressed air and considered air vent effect. The simulation results could serve as a good reference for engineers to solve the MUF problems.

Original languageEnglish
Title of host publication2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud
Subtitle of host publicationCreating Value and Toward Eco-Life, IMPACT 2013 - Proceedings
Pages310-314
Number of pages5
DOIs
Publication statusPublished - 2013 Dec 1
Event2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Taipei, Taiwan
Duration: 2013 Oct 222013 Oct 25

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013
CountryTaiwan
CityTaipei
Period13-10-2213-10-25

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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