Molecular dynamics simulation of copper reflow in the damascene process

Ming Horng Su; Chi Chuan Hwang; Jee Gong Chang; Shin Pon Ju

doi:10.1116/1.1501571

Molecular dynamics simulation of copper reflow in the damascene process

Ming Horng Su, Chi Chuan Hwang, Jee Gong Chang, Shin Pon Ju

Department of Engineering Science

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

An investigation of copper reflow in the damascene process using molecular dynamics simulation is presented. A simulation of the deposition process, with an investigation into the growing mechanism of the deposited atoms within the trench, is also included as well. The simulation results confirm the importance of the heating duration in achieving a successful reflow process in which the trench becomes completely filled by the deposited atoms.

Original language	English
Pages (from-to)	1853-1865
Number of pages	13
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	20
Issue number	5
DOIs	https://doi.org/10.1116/1.1501571
Publication status	Published - 2002 Sept

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
Electrical and Electronic Engineering

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10.1116/1.1501571

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abstract = "An investigation of copper reflow in the damascene process using molecular dynamics simulation is presented. A simulation of the deposition process, with an investigation into the growing mechanism of the deposited atoms within the trench, is also included as well. The simulation results confirm the importance of the heating duration in achieving a successful reflow process in which the trench becomes completely filled by the deposited atoms.",

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N2 - An investigation of copper reflow in the damascene process using molecular dynamics simulation is presented. A simulation of the deposition process, with an investigation into the growing mechanism of the deposited atoms within the trench, is also included as well. The simulation results confirm the importance of the heating duration in achieving a successful reflow process in which the trench becomes completely filled by the deposited atoms.

AB - An investigation of copper reflow in the damascene process using molecular dynamics simulation is presented. A simulation of the deposition process, with an investigation into the growing mechanism of the deposited atoms within the trench, is also included as well. The simulation results confirm the importance of the heating duration in achieving a successful reflow process in which the trench becomes completely filled by the deposited atoms.

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Molecular dynamics simulation of copper reflow in the damascene process

Abstract

All Science Journal Classification (ASJC) codes

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