Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones

Yun Che Wang, Jun Liang Chen, Chuan Chen, Yan Chi Chen, Chi Chuan Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.

Original languageEnglish
Title of host publicationProceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Pages583-585
Number of pages3
DOIs
Publication statusPublished - 2010 Jul 12
EventASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China
Duration: 2009 Dec 182009 Dec 21

Publication series

NameProceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Volume2

Other

OtherASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
CountryChina
CityShanghai
Period09-12-1809-12-21

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes

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