Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones

Yun Che Wang; Jun Liang Chen; Chuan Chen; Yan Chi Chen; Chi Chuan Hwang

doi:10.1115/MNHMT2009-18378

Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones

Yun Che Wang
, Jun Liang Chen
, Chuan Chen
, Yan Chi Chen
, Chi Chuan Hwang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.

Original language	English
Title of host publication	Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Pages	583-585
Number of pages	3
DOIs	https://doi.org/10.1115/MNHMT2009-18378
Publication status	Published - 2010 Jul 12
Event	ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China Duration: 2009 Dec 18 → 2009 Dec 21

Publication series

Name	Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Volume	2

Other

Other	ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Country/Territory	China
City	Shanghai
Period	09-12-18 → 09-12-21

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

All Science Journal Classification (ASJC) codes

Fluid Flow and Transfer Processes

Access to Document

10.1115/MNHMT2009-18378

Cite this

Wang, Y. C., Chen, J. L., Chen, C., Chen, Y. C., & Hwang, C. C. (2010). Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 (pp. 583-585). (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; Vol. 2). https://doi.org/10.1115/MNHMT2009-18378

Wang, Yun Che ; Chen, Jun Liang ; Chen, Chuan et al. / Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. pp. 583-585 (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009).

@inproceedings{98c40306bce64b309810e17f8edd2ab6,

title = "Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones",

abstract = "It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.",

author = "Wang, \{Yun Che\} and Chen, \{Jun Liang\} and Chuan Chen and Chen, \{Yan Chi\} and Hwang, \{Chi Chuan\}",

year = "2010",

month = jul,

day = "12",

doi = "10.1115/MNHMT2009-18378",

language = "English",

isbn = "9780791843895",

series = "Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009",

pages = "583--585",

booktitle = "Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009",

note = "ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 ; Conference date: 18-12-2009 Through 21-12-2009",

}

Wang, YC, Chen, JL, Chen, C, Chen, YC & Hwang, CC 2010, Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones. in Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, vol. 2, pp. 583-585, ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, Shanghai, China, 09-12-18. https://doi.org/10.1115/MNHMT2009-18378

Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones. / Wang, Yun Che; Chen, Jun Liang; Chen, Chuan et al.
Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. p. 583-585 (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones

AU - Wang, Yun Che

AU - Chen, Jun Liang

AU - Chen, Chuan

AU - Chen, Yan Chi

AU - Hwang, Chi Chuan

PY - 2010/7/12

Y1 - 2010/7/12

N2 - It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.

AB - It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.

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BT - Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009

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ER -

Wang YC, Chen JL, Chen C, Chen YC, Hwang CC. Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. p. 583-585. (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009). doi: 10.1115/MNHMT2009-18378

Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones

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