Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

Chia Wei Huang, Kwang-Lung Lin

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated that the Sn-9Zn solder formed Cu 5Zn 8 and CuZn 5 compounds on the Cu substrate, while the Al-containing solders formed the Al 4.2Cu 3.2Zn 0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn 3 compound at the interface between the Al 4.2Cu 3.2Zn 0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on the quantity of AgZn 3 compound formed at the interface. The AgZn 3 compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition. It was believed that the formation of the AgZn 3 compound at the interface occurs through heterogeneous nucleation during solidification.

Original languageEnglish
Pages (from-to)2135-2141
Number of pages7
JournalJournal of Electronic Materials
Volume35
Issue number12
DOIs
Publication statusPublished - 2006 Dec 1

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solders
Soldering alloys
Intermetallics
intermetallics
Lead
Substrates
Cooling
air cooling
soldering
Soldering
solidification
Solidification
Nucleation
nucleation
cooling
Water
Air
water

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Electrical and Electronic Engineering

Cite this

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abstract = "The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated that the Sn-9Zn solder formed Cu 5Zn 8 and CuZn 5 compounds on the Cu substrate, while the Al-containing solders formed the Al 4.2Cu 3.2Zn 0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn 3 compound at the interface between the Al 4.2Cu 3.2Zn 0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on the quantity of AgZn 3 compound formed at the interface. The AgZn 3 compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition. It was believed that the formation of the AgZn 3 compound at the interface occurs through heterogeneous nucleation during solidification.",
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Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates. / Huang, Chia Wei; Lin, Kwang-Lung.

In: Journal of Electronic Materials, Vol. 35, No. 12, 01.12.2006, p. 2135-2141.

Research output: Contribution to journalArticle

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AB - The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated that the Sn-9Zn solder formed Cu 5Zn 8 and CuZn 5 compounds on the Cu substrate, while the Al-containing solders formed the Al 4.2Cu 3.2Zn 0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn 3 compound at the interface between the Al 4.2Cu 3.2Zn 0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on the quantity of AgZn 3 compound formed at the interface. The AgZn 3 compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition. It was believed that the formation of the AgZn 3 compound at the interface occurs through heterogeneous nucleation during solidification.

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