MULTI-POINT TEMPERATURE SENSING METHOD FOR INTEGRATED CIRCUIT CHIP AND SYSTEM OF THE SAME

Kuen-Jong Lee (Inventor), Chung-Ho Chen (Inventor), Wen-Yu Su (Inventor), Soon-Jyh Chang (Inventor), Lih-Yih Chiou (Inventor), Chih-Hung Kuo (Inventor), Chien-Hung Tsai (Inventor), Jai-Ming Lin (Inventor)

Research output: Patent

Abstract

A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.
Translated title of the contribution適用於積體電路晶片之多點溫度感測方法及其系統
Original languageEnglish
Patent number9448122
Publication statusPublished - 2014 Nov 20

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