MULTI-POINT TEMPERATURE SENSING METHOD FOR INTEGRATED CIRCUIT CHIP AND SYSTEM OF THE SAME

Kuen-Jong Lee (Inventor), Chung-Ho Chen (Inventor), Wen-Yu Su (Inventor), Soon-Jyh Chang (Inventor), Lih-Yih Chiou (Inventor), Chih-Hung Kuo (Inventor), Chien-Hung Tsai (Inventor), Jai-Ming Lin (Inventor)

Research output: Patent

Abstract

A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.
Original languageEnglish
Patent number9448122
Publication statusPublished - 2014 Nov 20

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Temperature sensors
Integrated circuits
Temperature
Temperature control
Control systems
Electric potential

Cite this

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title = "MULTI-POINT TEMPERATURE SENSING METHOD FOR INTEGRATED CIRCUIT CHIP AND SYSTEM OF THE SAME",
abstract = "A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.",
author = "Kuen-Jong Lee and Chung-Ho Chen and Wen-Yu Su and Soon-Jyh Chang and Lih-Yih Chiou and Chih-Hung Kuo and Chien-Hung Tsai and Jai-Ming Lin",
year = "2014",
month = "11",
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type = "Patent",
note = "9448122",

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T1 - MULTI-POINT TEMPERATURE SENSING METHOD FOR INTEGRATED CIRCUIT CHIP AND SYSTEM OF THE SAME

AU - Lee, Kuen-Jong

AU - Chen, Chung-Ho

AU - Su, Wen-Yu

AU - Chang, Soon-Jyh

AU - Chiou, Lih-Yih

AU - Kuo, Chih-Hung

AU - Tsai, Chien-Hung

AU - Lin, Jai-Ming

PY - 2014/11/20

Y1 - 2014/11/20

N2 - A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.

AB - A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.

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ER -