Multiphysics modeling and analysis of the photoinductive imaging effect for crack detection

Cheng Chi Tai, Yen Lin Pan

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

Numerical multiphysics modeling of the photoinductive imaging (PI) effect was performed with a 2-D transient to characterize corner cracks at the edge of a specimen with a bolt hole. We present how the finite-element method (FEM) can be utilized to model the PI effect and observe the influence of critical factors on the coil probe impedance for a rectangular crack in the Ti-6Al-4V specimen. As anticipated, the proposed model can show that the PI method has a higher spatial resolution in the defect in 2-D models compared to the conventional eddy current testing method. The FEM simulation results for 0.25-, 0.50-, and 0.75-mm rectangular notches are shown and discussed. The effects of coil current frequency, laser-point temperature, and lift-off distance on the PI signal are also examined and analyzed. We demonstrate that the PI effect is a novel sensing method for characterizing the geometric shape of cracks and that the enhanced output signals of the coil probe can also be obtained given an appropriate quantity of factors.

Original languageEnglish
Article number5223571
Pages (from-to)425-432
Number of pages8
JournalIEEE Transactions on Instrumentation and Measurement
Volume59
Issue number2
DOIs
Publication statusPublished - 2010 Feb 1

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

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