Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation

Fu Ting Chang, Yung-Chun Lee, Chi Cheng Chiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.

Original languageEnglish
Title of host publication3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Pages850-853
Number of pages4
DOIs
Publication statusPublished - 2008
Event3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
Duration: 2008 Jan 62008 Jan 9

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Country/TerritoryChina
CitySanya
Period08-01-0608-01-09

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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