Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films

Chen-Kuei Chung, W. T. Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Conventional electroplated Ni films were performed at high temperatures of 45- 50°C. In this paper, we have studied the low temperature electroplating i.e. low temperature electroplating of nano-crystalline Ni films and their nanomechanical property. The deposits were electroplated in potentiostatic mode and the low electrolytic temperature varied from 0 to 20°C. Grazing incidence X-ray diffractometer was used to examine the polycrystalline phase characteristics and grain size. MTS Nano Indenter® with continuous stiffness measurement (CSM) module and Berkovich indenter were employed to characterize the nano-mechanical property of deposits. The experimental results showed that hardness increased with decreasing electrolytic temperature. It might be attributed to the residual compressive stress. Therefore, low temperature electroplating is favorable for the enhancement of Ni deposits hardness.

Original languageEnglish
Title of host publication2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Pages203-206
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 29
Event5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
Duration: 2010 Jan 202010 Jan 23

Publication series

Name2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Other

Other5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
CountryChina
CityXiamen
Period10-01-2010-01-23

Fingerprint

Crystalline materials
Electroplating
Deposits
Temperature
Hardness
Diffractometers
Compressive stress
Residual stresses
Stiffness
X rays
Mechanical properties

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Chung, C-K., & Chang, W. T. (2010). Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films. In 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 (pp. 203-206). [5592186] (2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010). https://doi.org/10.1109/NEMS.2010.5592186
Chung, Chen-Kuei ; Chang, W. T. / Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films. 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010. 2010. pp. 203-206 (2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010).
@inproceedings{fca40828ed544d3aa9e675c3fe522a4a,
title = "Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films",
abstract = "Conventional electroplated Ni films were performed at high temperatures of 45- 50°C. In this paper, we have studied the low temperature electroplating i.e. low temperature electroplating of nano-crystalline Ni films and their nanomechanical property. The deposits were electroplated in potentiostatic mode and the low electrolytic temperature varied from 0 to 20°C. Grazing incidence X-ray diffractometer was used to examine the polycrystalline phase characteristics and grain size. MTS Nano Indenter{\circledR} with continuous stiffness measurement (CSM) module and Berkovich indenter were employed to characterize the nano-mechanical property of deposits. The experimental results showed that hardness increased with decreasing electrolytic temperature. It might be attributed to the residual compressive stress. Therefore, low temperature electroplating is favorable for the enhancement of Ni deposits hardness.",
author = "Chen-Kuei Chung and Chang, {W. T.}",
year = "2010",
month = "11",
day = "29",
doi = "10.1109/NEMS.2010.5592186",
language = "English",
isbn = "9781424465439",
series = "2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010",
pages = "203--206",
booktitle = "2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010",

}

Chung, C-K & Chang, WT 2010, Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films. in 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010., 5592186, 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, pp. 203-206, 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, 10-01-20. https://doi.org/10.1109/NEMS.2010.5592186

Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films. / Chung, Chen-Kuei; Chang, W. T.

2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010. 2010. p. 203-206 5592186 (2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films

AU - Chung, Chen-Kuei

AU - Chang, W. T.

PY - 2010/11/29

Y1 - 2010/11/29

N2 - Conventional electroplated Ni films were performed at high temperatures of 45- 50°C. In this paper, we have studied the low temperature electroplating i.e. low temperature electroplating of nano-crystalline Ni films and their nanomechanical property. The deposits were electroplated in potentiostatic mode and the low electrolytic temperature varied from 0 to 20°C. Grazing incidence X-ray diffractometer was used to examine the polycrystalline phase characteristics and grain size. MTS Nano Indenter® with continuous stiffness measurement (CSM) module and Berkovich indenter were employed to characterize the nano-mechanical property of deposits. The experimental results showed that hardness increased with decreasing electrolytic temperature. It might be attributed to the residual compressive stress. Therefore, low temperature electroplating is favorable for the enhancement of Ni deposits hardness.

AB - Conventional electroplated Ni films were performed at high temperatures of 45- 50°C. In this paper, we have studied the low temperature electroplating i.e. low temperature electroplating of nano-crystalline Ni films and their nanomechanical property. The deposits were electroplated in potentiostatic mode and the low electrolytic temperature varied from 0 to 20°C. Grazing incidence X-ray diffractometer was used to examine the polycrystalline phase characteristics and grain size. MTS Nano Indenter® with continuous stiffness measurement (CSM) module and Berkovich indenter were employed to characterize the nano-mechanical property of deposits. The experimental results showed that hardness increased with decreasing electrolytic temperature. It might be attributed to the residual compressive stress. Therefore, low temperature electroplating is favorable for the enhancement of Ni deposits hardness.

UR - http://www.scopus.com/inward/record.url?scp=78649303174&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78649303174&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2010.5592186

DO - 10.1109/NEMS.2010.5592186

M3 - Conference contribution

SN - 9781424465439

T3 - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

SP - 203

EP - 206

BT - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

ER -

Chung C-K, Chang WT. Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films. In 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010. 2010. p. 203-206. 5592186. (2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010). https://doi.org/10.1109/NEMS.2010.5592186