Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films

Chen-Kuei Chung, W. T. Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Conventional electroplated Ni films were performed at high temperatures of 45- 50°C. In this paper, we have studied the low temperature electroplating i.e. low temperature electroplating of nano-crystalline Ni films and their nanomechanical property. The deposits were electroplated in potentiostatic mode and the low electrolytic temperature varied from 0 to 20°C. Grazing incidence X-ray diffractometer was used to examine the polycrystalline phase characteristics and grain size. MTS Nano Indenter® with continuous stiffness measurement (CSM) module and Berkovich indenter were employed to characterize the nano-mechanical property of deposits. The experimental results showed that hardness increased with decreasing electrolytic temperature. It might be attributed to the residual compressive stress. Therefore, low temperature electroplating is favorable for the enhancement of Ni deposits hardness.

Original languageEnglish
Title of host publication2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Pages203-206
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 29
Event5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
Duration: 2010 Jan 202010 Jan 23

Publication series

Name2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Other

Other5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Country/TerritoryChina
CityXiamen
Period10-01-2010-01-23

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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