Nanoindentation characterization of PECVD silicon nitride on silicon subjected to mechanical fatigue loading

Z. K. Huang, K. S. Ou, Kuo-Shen Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this work, the mechanical properties of PECVD silicon nitride deposited on silicon substrates by two different processing conditions were investigated. Indentation method was primary used for qualitatively examining the effect of process conditions to the achieved mechanical properties. The experimental results indicated that the residual stress, fracture toughness and interfacial strength, as well as the fatigue crack propagation were strongly depended on the processing conditions such as deposition temperatures and chamber pressures. Preliminary results indicated that the specimen deposited at a lower temperature and a lower pressure exhibited a much less residual tensile stress and a better interface strength. On the other hand, it was found that RTA could enhance the interfacial strength but the generated high tensile strength could actually reduce the equivalent toughness and leads to structural reliability concerns. In summary, the characterization results should be possible to provide useful information for correlating the mechanical reliability with the processing parameters for future structural design optimization and for improving the structural integrity of PECVD silicon nitride films for MEMS and IC fabrication.

Original languageEnglish
Title of host publicationMicroelectromechanical Systems - Materials and Devices IV
Pages173-178
Number of pages6
DOIs
Publication statusPublished - 2011 Sep 30
Event2010 MRS Fall Meeting - Boston, MA, United States
Duration: 2010 Nov 292010 Dec 3

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1299
ISSN (Print)0272-9172

Other

Other2010 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period10-11-2910-12-03

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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