Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications

Yu Tao Yang, Chaowei Hu, Peng Zhang, Niloofar Shakoorzadeh, Haoxiang Ren, Ni Ni, Kang L. Wang, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

As the number of qubits goes beyond one million, the I/O count and the interconnect wiring within a limited area become problematic. In this paper, we present a simple integration method (an Au interiayer) with a fine interconnect pitch (10 urn) and close lateral die spacing (60 urn) that can overcome the large I/O and high wiring level requirements of very large scale of quantum circuits. A System-on Wafer (SoW) Superconducting Silicon Interconnect Fabric (Superconducting-ID is proposed with the help of the mentioned Au interiayer technology. Through three testing structures, the Au interiayer integration technology is demonstrated to be fine pitch (<10 urn), Josephson-Junction-compatible (<150°C), mechanically robust (> 30 MPa) on various bonding areas, and electrically reliable at 2 K. It is one of the first demonstrations of the robust and reliable Au interiayer optimized for quantum applications. This work enables quantum computing to uncover its full strength through high-density (>10000 mm2 I/O and dense wiring) heterogeneous integration.

Original languageEnglish
Title of host publicationProceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1577-1582
Number of pages6
ISBN (Electronic)9780738145235
DOIs
Publication statusPublished - 2021
Event71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States
Duration: 2021 Jun 12021 Jul 4

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2021-June
ISSN (Print)0569-5503

Conference

Conference71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period21-06-0121-07-04

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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