TY - JOUR
T1 - Nitride-based flip-chip LEDs with transparent ohmic contacts and reflective mirrors
AU - Chang, Shoou-Jinn
AU - Chen, W. S.
AU - Lin, Yu-Cheng
AU - Chang, C. S.
AU - Ko, T. K.
AU - Hsu, Y. P.
AU - Shen, C. F.
AU - Tsai, J. M.
AU - Shei, S. C.
PY - 2006/8/1
Y1 - 2006/8/1
N2 - Nitride-based flip-chip light-emitting diodes (LEDs) with various transparent ohmic contacts and reflective mirrors were fabricated. At 470 nm, it was found that Ni could provide 92% transmittance while Ag could provide 92.4% reflectively. It was also found that the 20-mA forward voltages measured from LEDs with Ni+Ag, Ni+Al, and Ni+Pt were 3.15, 3.29, and 3.18 V while the output powers were 16, 13.3, and 11.6 mW, respectively. Furthermore, it was found that lifetimes of the fabricated flip-chip LEDs were good.
AB - Nitride-based flip-chip light-emitting diodes (LEDs) with various transparent ohmic contacts and reflective mirrors were fabricated. At 470 nm, it was found that Ni could provide 92% transmittance while Ag could provide 92.4% reflectively. It was also found that the 20-mA forward voltages measured from LEDs with Ni+Ag, Ni+Al, and Ni+Pt were 3.15, 3.29, and 3.18 V while the output powers were 16, 13.3, and 11.6 mW, respectively. Furthermore, it was found that lifetimes of the fabricated flip-chip LEDs were good.
UR - http://www.scopus.com/inward/record.url?scp=33747599183&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33747599183&partnerID=8YFLogxK
U2 - 10.1109/TADVP.2006.871189
DO - 10.1109/TADVP.2006.871189
M3 - Article
AN - SCOPUS:33747599183
VL - 29
SP - 403
EP - 408
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
SN - 1521-3323
IS - 3
ER -