TY - JOUR
T1 - Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration
AU - Liang, Chien Lung
AU - Lin, Kwang Lung
N1 - Funding Information:
The authors gratefully acknowledge the financial support of the present study from the Ministry of Science and Technology of the Republic of China under MOST107-2221-E-006-015-MY3 .
Publisher Copyright:
© 2019 Elsevier B.V.
PY - 2019/6/15
Y1 - 2019/6/15
N2 - The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by electromigration was investigated, for the first time, under room temperature. The sub-micron dimension solder interconnect was fabricated using a magnetron sputtering technique. The athermal electromigration force, rather than the Joule heating, induced a net Cu diffusion flux across the cathode Cu/Sn interface toward the Sn matrix (along the electron flow direction). The accumulation of Cu atoms formed meta-stable supersaturation of Cu in Sn. A local distorted lattice structures was formed as evidenced by spherical aberration corrected scanning transmission electron microscope. The Cu supersaturation behavior was governed by grain boundary diffusion in the polycrystalline Cu electrode and interstitial diffusion in the single crystal Sn matrix. The extent of supersaturation in the metal matrix is affected by electromigration period and geometrical (cathode/anode electrode) parameter.
AB - The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by electromigration was investigated, for the first time, under room temperature. The sub-micron dimension solder interconnect was fabricated using a magnetron sputtering technique. The athermal electromigration force, rather than the Joule heating, induced a net Cu diffusion flux across the cathode Cu/Sn interface toward the Sn matrix (along the electron flow direction). The accumulation of Cu atoms formed meta-stable supersaturation of Cu in Sn. A local distorted lattice structures was formed as evidenced by spherical aberration corrected scanning transmission electron microscope. The Cu supersaturation behavior was governed by grain boundary diffusion in the polycrystalline Cu electrode and interstitial diffusion in the single crystal Sn matrix. The extent of supersaturation in the metal matrix is affected by electromigration period and geometrical (cathode/anode electrode) parameter.
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U2 - 10.1016/j.jallcom.2019.03.055
DO - 10.1016/j.jallcom.2019.03.055
M3 - Article
AN - SCOPUS:85062610360
VL - 789
SP - 336
EP - 344
JO - Journal of the Less-Common Metals
JF - Journal of the Less-Common Metals
SN - 0925-8388
ER -