Abstract
The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by electromigration was investigated, for the first time, under room temperature. The sub-micron dimension solder interconnect was fabricated using a magnetron sputtering technique. The athermal electromigration force, rather than the Joule heating, induced a net Cu diffusion flux across the cathode Cu/Sn interface toward the Sn matrix (along the electron flow direction). The accumulation of Cu atoms formed meta-stable supersaturation of Cu in Sn. A local distorted lattice structures was formed as evidenced by spherical aberration corrected scanning transmission electron microscope. The Cu supersaturation behavior was governed by grain boundary diffusion in the polycrystalline Cu electrode and interstitial diffusion in the single crystal Sn matrix. The extent of supersaturation in the metal matrix is affected by electromigration period and geometrical (cathode/anode electrode) parameter.
| Original language | English |
|---|---|
| Pages (from-to) | 336-344 |
| Number of pages | 9 |
| Journal | Journal of Alloys and Compounds |
| Volume | 789 |
| DOIs | |
| Publication status | Published - 2019 Jun 15 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry
Cite this
}
Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration. / Liang, Chien Lung; Lin, Kwang Lung.
In: Journal of Alloys and Compounds, Vol. 789, 15.06.2019, p. 336-344.Research output: Contribution to journal › Article
TY - JOUR
T1 - Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration
AU - Liang, Chien Lung
AU - Lin, Kwang Lung
PY - 2019/6/15
Y1 - 2019/6/15
N2 - The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by electromigration was investigated, for the first time, under room temperature. The sub-micron dimension solder interconnect was fabricated using a magnetron sputtering technique. The athermal electromigration force, rather than the Joule heating, induced a net Cu diffusion flux across the cathode Cu/Sn interface toward the Sn matrix (along the electron flow direction). The accumulation of Cu atoms formed meta-stable supersaturation of Cu in Sn. A local distorted lattice structures was formed as evidenced by spherical aberration corrected scanning transmission electron microscope. The Cu supersaturation behavior was governed by grain boundary diffusion in the polycrystalline Cu electrode and interstitial diffusion in the single crystal Sn matrix. The extent of supersaturation in the metal matrix is affected by electromigration period and geometrical (cathode/anode electrode) parameter.
AB - The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by electromigration was investigated, for the first time, under room temperature. The sub-micron dimension solder interconnect was fabricated using a magnetron sputtering technique. The athermal electromigration force, rather than the Joule heating, induced a net Cu diffusion flux across the cathode Cu/Sn interface toward the Sn matrix (along the electron flow direction). The accumulation of Cu atoms formed meta-stable supersaturation of Cu in Sn. A local distorted lattice structures was formed as evidenced by spherical aberration corrected scanning transmission electron microscope. The Cu supersaturation behavior was governed by grain boundary diffusion in the polycrystalline Cu electrode and interstitial diffusion in the single crystal Sn matrix. The extent of supersaturation in the metal matrix is affected by electromigration period and geometrical (cathode/anode electrode) parameter.
UR - http://www.scopus.com/inward/record.url?scp=85062610360&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85062610360&partnerID=8YFLogxK
U2 - 10.1016/j.jallcom.2019.03.055
DO - 10.1016/j.jallcom.2019.03.055
M3 - Article
AN - SCOPUS:85062610360
VL - 789
SP - 336
EP - 344
JO - Journal of Alloys and Compounds
JF - Journal of Alloys and Compounds
SN - 0925-8388
ER -