Nonlinear dependence of Cu dishing depth on the microstructure of polishing pads during chemical mechanical polishing

Te Ming Kung, Chuan-Pu Liu, Shih Chieh Chang, Kei Wei Chen, Ying Lang Wang

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Nonlinear dependence of Cu dishing depth on the microstructure of polishing pads during chemical mechanical polishing'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds