Nonlinear viscoelastic constitutive model for organic laminate substrate

Tz Cheng Chiu, Yao Yu Chan, Yi Shao Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Organic laminate substrate is one of the largest constituent volume-wise in area array packages, and it plays a key role in overall package stress and warpage evolutions during fabrication process and in service conditions. In order to accurately estimate the influences of substrate on stress and warpage, it is important to characterize the time-dependent constitutive behavior of the organic substrate. In this study, a series of tensile creep and creep recovery experiments were performed to characterize the time-dependent behavior of a single-core laminate substrate. Nonlinear viscoelastic constitutive models including the Schapery model and a time-temperature-stress superposition model were developed based on the experimental characterization, and applied to simulate strain responses under cyclic loading conditions. It is shown that the predictions based on the nonlinear viscoelastic models give more accurate estimations on strain responses to creep and creep recovery loadings than the linear viscoelastic model does, in particularly for stress levels higher than 30% of the substrate's fracture strength.

Original languageEnglish
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages1759-1766
Number of pages8
DOIs
Publication statusPublished - 2013 Sep 9
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: 2013 May 282013 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Country/TerritoryUnited States
CityLas Vegas, NV
Period13-05-2813-05-31

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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