Novel bonding technique using hydrophilic SU-8

Yu Tzu Chen, Denz Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a novel bonding technique for fabricating microfluidic devices with surfactant-added SU-8 (hydrophilic SU-8) as structure. The technique is based on an adhesive wafer bonding process. The hydrophilic SU-8 plays the roles of adhesive layer as well as structural layer. Due to its special feature, the layer can be directly bonded to various substrates (glass, silicon or poly(dimethylsiloxane)) after oxygen plasma treatment. The present bonding technique does not need another SU-8 adhesive layer for bonding. Neither is an expensive bonding system needed. The technique is fast, convenient, secure and inexpensive with standard photolithography.

Original languageEnglish
Title of host publicationProceedings of the 11th International Conference on Miniaturized Systems for Chemistry and Life Sciences, uTAS 2007
EditorsJean-Louis Viovy, Patrick Tabeling, Stephanie Descroix, Laurent Malaquin
PublisherChemical and Biological Microsystems Society
Pages1119-1121
Number of pages3
ISBN (Electronic)9780979806407
Publication statusPublished - 2007
Event11th International Conference on Miniaturized Systems for Chemistry and Life Sciences, uTAS 2007 - Paris, France
Duration: 2007 Oct 72007 Oct 11

Publication series

NameProceedings of the 11th International Conference on Miniaturized Systems for Chemistry and Life Sciences, uTAS 2007

Conference

Conference11th International Conference on Miniaturized Systems for Chemistry and Life Sciences, uTAS 2007
CountryFrance
CityParis
Period07-10-0707-10-11

All Science Journal Classification (ASJC) codes

  • Chemical Engineering (miscellaneous)
  • Bioengineering

Fingerprint Dive into the research topics of 'Novel bonding technique using hydrophilic SU-8'. Together they form a unique fingerprint.

Cite this