Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam

Tao Chi Liu, Chih Chen, Kuo Jung Chiu, Han Wen Lin, Jui-Chao Kuo

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing.

Original languageEnglish
Pages (from-to)42-48
Number of pages7
JournalMaterials Characterization
Volume74
DOIs
Publication statusPublished - 2012 Dec 1

Fingerprint

Focused ion beams
Polishing
polishing
Electron diffraction
ion beams
preparation
diffraction
electrons
high acceleration
mechanical measurement
Gallium
solders
Soldering alloys
Ion beams
gallium
surface roughness
Surface roughness
Electric potential
electric potential

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Liu, Tao Chi ; Chen, Chih ; Chiu, Kuo Jung ; Lin, Han Wen ; Kuo, Jui-Chao. / Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam. In: Materials Characterization. 2012 ; Vol. 74. pp. 42-48.
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Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam. / Liu, Tao Chi; Chen, Chih; Chiu, Kuo Jung; Lin, Han Wen; Kuo, Jui-Chao.

In: Materials Characterization, Vol. 74, 01.12.2012, p. 42-48.

Research output: Contribution to journalArticle

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