Novel heat dissipation design for light emitting diode applications

Chemical Compounds

• Cooling 12%
• Dissipation 62%
• Heat 42%
• Heat Pipe 100%
• Heat Transfer 15%
• Packaging Material 17%
• Simulation 9%
• Thermal Diffusion 19%
• Thermal Resistance 17%
• Volume 8%

Engineering & Materials Science

• Cooling 4%
• Copper 15%
• Experiments 2%
• Heat losses 57%
• Heat pipes 28%
• Heat resistance 6%
• Heat sinks 6%
• Heat transfer 4%
• Hot Temperature 6%
• Light emitting diodes 56%
• Lighting 5%
• Packaging 5%
• Packaging materials 8%
• Pipe 4%
• Steam 5%
• Temperature 7%
• Thermal diffusion 8%
• Water 6%
• Working fluids 6%

Physics & Astronomy

• assembly 16%
• chips 10%
• cooling 39%
• copper 13%
• dissipation 5%
• heat 4%
• heat pipes 34%
• heat sinks 7%
• heat transfer 4%
• illumination 4%
• light emitting diodes 45%
• packaging 13%
• simulation 2%
• steam 6%
• temperature 3%
• thermal diffusion 7%
• thermal resistance 6%
• water 3%
• water temperature 8%
• working fluids 7%