Novel polymeric surfactants for improving chemical mechanical polishing performance of silicon oxide

Engineering & Materials Science

• Abrasives 17%
• Chemical mechanical polishing 90%
• Contact angle 18%
• Oxides 29%
• Particle size 16%
• Potassium hydroxide 26%
• Silica 53%
• Silicon oxides 100%
• Slurries 21%
• Surface active agents 75%
• Surface tension 18%
• Viscosity 28%

Physics & Astronomy

• abrasives 20%
• evaluation 10%
• interfacial tension 15%
• nonuniformity 17%
• oxides 21%
• performance 30%
• polishing 72%
• potassium hydroxides 25%
• silicon dioxide 39%
• silicon oxides 72%
• slurries 22%
• surfactants 66%
• viscosity 24%
• wafers 12%

Chemical Compounds

• Abrasive 42%
• Methyl Methacrylate 32%
• Oxide 37%
• Polishing 80%
• Potassium Hydroxide 38%
• Silicon Oxide 85%
• Surfactant 46%