A novel positive-working and aqueous-base-developable photosensitive polydmide benzoxazole) precursor based on a poly(amic acid hydroxyamide) bearing phenolic hydroxyl groups and carboxylic acid groups, a diazonaphthoquinone (DNQ) photosensitive compound, and a solvent was developed. Poly(amic acid hydroxyamide) was prepared through the polymerization of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, trimellitic anhydride chloride, and 4,4′-oxydibenzoyl chloride. Subsequently, the thermal cyclization of the poly(amic acid hydroxyamide) precursor at 350°C produced the corresponding polydmide benzoxazole). The inherent viscosity of the precursor polymer was 0.17 dL/g. The cyclized poly(imide benzoxazole) showed a high glass-transition temperature of 372°C and 5% weight loss temperatures of 535°C in nitrogen and 509°C in air. The structures of the precursor polymer and the fully cyclized polymer were characterized with Fourier transform infrared and 1H NMR. The photosensitive polyimide precursor containing 25 wt % DNQ photoactive compound showed a sensitivity of 256 mJ/cm2 and a contrast of 1.14 in a 3-μm film with a 0.6 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from this composition.
|Number of pages||9|
|Journal||Journal of Polymer Science, Part A: Polymer Chemistry|
|Publication status||Published - 2004 Dec 1|
All Science Journal Classification (ASJC) codes
- Polymers and Plastics
- Organic Chemistry
- Materials Chemistry