TY - GEN
T1 - Novel semiconductor business model - Engineering chain for the semiconductor industry
AU - Chang, Jonathan Yung Cheng
AU - Cheng, Fan-Tien
AU - Wang, Tsung Li
PY - 2007/11/27
Y1 - 2007/11/27
N2 - The foundry business model was first developed by TSMC in 1985. A foundry should provide customers with IC manufacturing services. Those customers include IC design houses, integrated device manufacturers (IDM), and system suppliers. However, most electronic products are consumer products, and their life cycle has been reducing with time. An IC design house needs to continuously develop ICs with new functions to meet the current market demand for consumable products. Meanwhile, to support customers for high speed and low cost end product development, foundry service providers must also continue developing new process technologies, from 0.25um down to 32nm. Unfortunately, advances in new manufacturing process technologies also create difficulties in new IC design. These advances increase the IC design failure rate. Currently, no effective working model and system exists to solve this problem. To formulate this high IC design failure problem, this work proposes a novel Engineering-Chain (EC) business model. This work also proposes an Engineering Chain Management System (ECMS) to help achieve the goals of EC, such as improving IC design success rate, reducing IC design cycle time, lowering IC design costs, and increasing revenue.
AB - The foundry business model was first developed by TSMC in 1985. A foundry should provide customers with IC manufacturing services. Those customers include IC design houses, integrated device manufacturers (IDM), and system suppliers. However, most electronic products are consumer products, and their life cycle has been reducing with time. An IC design house needs to continuously develop ICs with new functions to meet the current market demand for consumable products. Meanwhile, to support customers for high speed and low cost end product development, foundry service providers must also continue developing new process technologies, from 0.25um down to 32nm. Unfortunately, advances in new manufacturing process technologies also create difficulties in new IC design. These advances increase the IC design failure rate. Currently, no effective working model and system exists to solve this problem. To formulate this high IC design failure problem, this work proposes a novel Engineering-Chain (EC) business model. This work also proposes an Engineering Chain Management System (ECMS) to help achieve the goals of EC, such as improving IC design success rate, reducing IC design cycle time, lowering IC design costs, and increasing revenue.
UR - http://www.scopus.com/inward/record.url?scp=36348999202&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=36348999202&partnerID=8YFLogxK
U2 - 10.1109/ROBOT.2007.363552
DO - 10.1109/ROBOT.2007.363552
M3 - Conference contribution
AN - SCOPUS:36348999202
SN - 1424406021
SN - 9781424406029
T3 - Proceedings - IEEE International Conference on Robotics and Automation
SP - 1597
EP - 1602
BT - 2007 IEEE International Conference on Robotics and Automation, ICRA'07
T2 - 2007 IEEE International Conference on Robotics and Automation, ICRA'07
Y2 - 10 April 2007 through 14 April 2007
ER -