Numerical analysis of the effect of thin-film thickness and material in field mapping of eddy-current probes using photoinductive technique

Yen Lin Pan, Cheng-Chi Tai, Dong Shong Liang

Research output: Contribution to journalArticle

Abstract

Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM).We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The fieldmapping signals using the appropriate actual metal film material for EC probe coil with 0°, 5°, 10°, 15°, and 20° tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.

Original languageEnglish
Pages (from-to)86-92
Number of pages7
JournalIEICE Transactions on Electronics
VolumeE95-C
Issue number1
DOIs
Publication statusPublished - 2012 Jan 1

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Eddy currents
Film thickness
Numerical analysis
Metals
Thin films
Thermal conductivity
Eddy current testing
Finite element method
Inspection

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

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abstract = "Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM).We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The fieldmapping signals using the appropriate actual metal film material for EC probe coil with 0°, 5°, 10°, 15°, and 20° tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.",
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Numerical analysis of the effect of thin-film thickness and material in field mapping of eddy-current probes using photoinductive technique. / Pan, Yen Lin; Tai, Cheng-Chi; Liang, Dong Shong.

In: IEICE Transactions on Electronics, Vol. E95-C, No. 1, 01.01.2012, p. 86-92.

Research output: Contribution to journalArticle

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