Numerical implementation of a unified viscoplastic model for considering solder joint response under board-level temperature cycling

Hung Chun Yang, Tz Cheng Chiu

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Numerical implementation of a unified viscoplastic model for considering solder joint response under board-level temperature cycling'. Together they form a unique fingerprint.

Engineering

Material Science

Keyphrases