Octanethiolated Cu and Cu 2 O nanoparticles as ink to form metallic copper film

T. Y. Dong, H. H. Wu, C. Huang, J. M. Song, I. G. Chen, T. H. Kao

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)

Abstract

The synthesis and spectroscopic characterizations of size-controlled Cu and Cu 2 O nanoparticles forming self-assembled 2D superlattices with hexagonal packing are described. The scanning electron microscopy (SEM), nuclear magnetic resonance (NMR), and X-ray photoelectron spectroscopy (XPS) were used to characterize the octanethiol-protected copper nanoparticles. Analysis of XPS confirms the formation of oxidized copper nanoparticles. Conductivity of copper metal film (0.1 μm) on the Si wafer can be improved simply by thermal annealing of copper monolayer protected clusters (MPCs) film (4.8 ± 0.5 × 10 2 μΩ cm) under air at 300 °C for 1 h, and then for another 5 h under a protective atmosphere of 90% N 2 -10% H 2 .

Original languageEnglish
Pages (from-to)3891-3896
Number of pages6
JournalApplied Surface Science
Volume255
Issue number6
DOIs
Publication statusPublished - 2009 Jan 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Physics and Astronomy(all)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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