Abstract
Low-resistance ohmic contacts are demonstrated using thin p-type InGaN layers on p-type GaN. It is shown that the tunneling barrier width is drastically reduced by polarization-induced electric fields in the strained InGaN capping layers resulting in an increase of the hole tunneling probability through the barrier and a significant decrease of the specific contact resistance. The specific contact resistance of Ni (10 nm)/Au (30 nm) contacts deposited on the InGaN capping layers was determined by the transmission line method. Specific contact resistances of 1.2×10-2cm2 and 6×10-3cm2 were obtained for capping layer thicknesses of 20 nm and 2 nm, respectively.
Original language | English |
---|---|
Pages (from-to) | 986-988 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 80 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2002 Feb 11 |
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)