On mold corner effects of EMC adhesion for IC encapsulation process

Chia Hsun Yeh, Chen Hung Deng, Huei-Huang Lee, Sheng-Jye Hwang, Durn Yuan Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold. At the same time, adhesion may occur in the interface between the surface of mold and cured EMC. Large adhesion force could cause many problems, which may influence the ejection process. Some other critical problems may also happen in the IC molding process if adhesion problem occurs, such as distortion or crack on ejecting finished parts, residue of cured EMC on the surface of mold affecting the quality of the products, and regular, tedious and not effective mold cleaning. So how to improve the mold adhesion force effectively is an important issue for industry and research institutes. To avoid the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Among these, applying suitable surface coating is a more popular and practical approach. This study described the approach of using a semi-automatic EMC adhesion force test instrument to measure adhesion force between the mold surface and EMC and studied the corner effect during the encapsulation process. Three different cavity arcs were designed in three specimens and molded and tested during molding to observe the corner effects. Engineers could determine the best type of surface treatment and the type of corner to reduce the amount of mold adhesion force. This paper also discussed the issue of successive adhesion force test and the variation of adhesion force during successive molding test to predict the time for mold cleaning. It was found that larger corner would cause smaller adhesion force. Repeat experiments were executed and found that the test results could be repeated.

Original languageEnglish
Title of host publication2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
Pages280-283
Number of pages4
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 - Taipei, Taiwan
Duration: 2011 Oct 182011 Oct 21

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
CountryTaiwan
CityTaipei
Period11-10-1811-10-21

Fingerprint

Sheet molding compounds
Encapsulation
Adhesion
Molding
Surface treatment
Cleaning
Coatings
Packaging

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Yeh, C. H., Deng, C. H., Lee, H-H., Hwang, S-J., & Huang, D. Y. (2011). On mold corner effects of EMC adhesion for IC encapsulation process. In 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 (pp. 280-283). [6117263] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2011.6117263
Yeh, Chia Hsun ; Deng, Chen Hung ; Lee, Huei-Huang ; Hwang, Sheng-Jye ; Huang, Durn Yuan. / On mold corner effects of EMC adhesion for IC encapsulation process. 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. 2011. pp. 280-283 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).
@inproceedings{6e15e1f68c1d41a19c39714bc5df77ea,
title = "On mold corner effects of EMC adhesion for IC encapsulation process",
abstract = "In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold. At the same time, adhesion may occur in the interface between the surface of mold and cured EMC. Large adhesion force could cause many problems, which may influence the ejection process. Some other critical problems may also happen in the IC molding process if adhesion problem occurs, such as distortion or crack on ejecting finished parts, residue of cured EMC on the surface of mold affecting the quality of the products, and regular, tedious and not effective mold cleaning. So how to improve the mold adhesion force effectively is an important issue for industry and research institutes. To avoid the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Among these, applying suitable surface coating is a more popular and practical approach. This study described the approach of using a semi-automatic EMC adhesion force test instrument to measure adhesion force between the mold surface and EMC and studied the corner effect during the encapsulation process. Three different cavity arcs were designed in three specimens and molded and tested during molding to observe the corner effects. Engineers could determine the best type of surface treatment and the type of corner to reduce the amount of mold adhesion force. This paper also discussed the issue of successive adhesion force test and the variation of adhesion force during successive molding test to predict the time for mold cleaning. It was found that larger corner would cause smaller adhesion force. Repeat experiments were executed and found that the test results could be repeated.",
author = "Yeh, {Chia Hsun} and Deng, {Chen Hung} and Huei-Huang Lee and Sheng-Jye Hwang and Huang, {Durn Yuan}",
year = "2011",
month = "12",
day = "1",
doi = "10.1109/IMPACT.2011.6117263",
language = "English",
isbn = "9781457713880",
series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",
pages = "280--283",
booktitle = "2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011",

}

Yeh, CH, Deng, CH, Lee, H-H, Hwang, S-J & Huang, DY 2011, On mold corner effects of EMC adhesion for IC encapsulation process. in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011., 6117263, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, pp. 280-283, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011, Taipei, Taiwan, 11-10-18. https://doi.org/10.1109/IMPACT.2011.6117263

On mold corner effects of EMC adhesion for IC encapsulation process. / Yeh, Chia Hsun; Deng, Chen Hung; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn Yuan.

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. 2011. p. 280-283 6117263 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - On mold corner effects of EMC adhesion for IC encapsulation process

AU - Yeh, Chia Hsun

AU - Deng, Chen Hung

AU - Lee, Huei-Huang

AU - Hwang, Sheng-Jye

AU - Huang, Durn Yuan

PY - 2011/12/1

Y1 - 2011/12/1

N2 - In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold. At the same time, adhesion may occur in the interface between the surface of mold and cured EMC. Large adhesion force could cause many problems, which may influence the ejection process. Some other critical problems may also happen in the IC molding process if adhesion problem occurs, such as distortion or crack on ejecting finished parts, residue of cured EMC on the surface of mold affecting the quality of the products, and regular, tedious and not effective mold cleaning. So how to improve the mold adhesion force effectively is an important issue for industry and research institutes. To avoid the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Among these, applying suitable surface coating is a more popular and practical approach. This study described the approach of using a semi-automatic EMC adhesion force test instrument to measure adhesion force between the mold surface and EMC and studied the corner effect during the encapsulation process. Three different cavity arcs were designed in three specimens and molded and tested during molding to observe the corner effects. Engineers could determine the best type of surface treatment and the type of corner to reduce the amount of mold adhesion force. This paper also discussed the issue of successive adhesion force test and the variation of adhesion force during successive molding test to predict the time for mold cleaning. It was found that larger corner would cause smaller adhesion force. Repeat experiments were executed and found that the test results could be repeated.

AB - In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold. At the same time, adhesion may occur in the interface between the surface of mold and cured EMC. Large adhesion force could cause many problems, which may influence the ejection process. Some other critical problems may also happen in the IC molding process if adhesion problem occurs, such as distortion or crack on ejecting finished parts, residue of cured EMC on the surface of mold affecting the quality of the products, and regular, tedious and not effective mold cleaning. So how to improve the mold adhesion force effectively is an important issue for industry and research institutes. To avoid the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches. Among these, applying suitable surface coating is a more popular and practical approach. This study described the approach of using a semi-automatic EMC adhesion force test instrument to measure adhesion force between the mold surface and EMC and studied the corner effect during the encapsulation process. Three different cavity arcs were designed in three specimens and molded and tested during molding to observe the corner effects. Engineers could determine the best type of surface treatment and the type of corner to reduce the amount of mold adhesion force. This paper also discussed the issue of successive adhesion force test and the variation of adhesion force during successive molding test to predict the time for mold cleaning. It was found that larger corner would cause smaller adhesion force. Repeat experiments were executed and found that the test results could be repeated.

UR - http://www.scopus.com/inward/record.url?scp=84863152475&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84863152475&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2011.6117263

DO - 10.1109/IMPACT.2011.6117263

M3 - Conference contribution

SN - 9781457713880

T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

SP - 280

EP - 283

BT - 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011

ER -

Yeh CH, Deng CH, Lee H-H, Hwang S-J, Huang DY. On mold corner effects of EMC adhesion for IC encapsulation process. In 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. 2011. p. 280-283. 6117263. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2011.6117263