Numerical calculations based on a hybrid method, which consists of analytic and finite-element method, have been carried out to study temperature distributions of multi-chip packages. Unlike finite element method, this method is able to discretize the distributed sources with discontinuities into coarse elements, and the solution is still accurately calculated. The effect of Reynolds number and channel wall-to-wall spacing were investigated. The results obtained from the numerical study have been compared with the previous experimental data, and found to be favorable.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Fluid Flow and Transfer Processes