On temperature prediction of multiple-chip packages by a combined analysis-finite element method

Horng Wen Wu, Ming Che Liu

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Numerical calculations based on a hybrid method, which consists of analytic and finite-element method, have been carried out to study temperature distributions of multi-chip packages. Unlike finite element method, this method is able to discretize the distributed sources with discontinuities into coarse elements, and the solution is still accurately calculated. The effect of Reynolds number and channel wall-to-wall spacing were investigated. The results obtained from the numerical study have been compared with the previous experimental data, and found to be favorable.

Original languageEnglish
Pages (from-to)197-204
Number of pages8
JournalHeat and Mass Transfer
Volume30
Issue number3
DOIs
Publication statusPublished - 1995 Feb 1

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Fluid Flow and Transfer Processes

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