TY - GEN
T1 - On the temperature compensation of parallel piezoresistive microcantilevers in biosensors
AU - Yang, S. M.
AU - Chang, C.
AU - Yin, T. I.
PY - 2008
Y1 - 2008
N2 - Microcantilever with embedded piezoresistor has been applied to in-situ surface stress measurement of biochemical reaction, where parallel microcantilever design by using an active cantilever for biosensing and another reference cantilever for noise cancellation has previously been proposed. This paper shows that the measurement is sensitive to the temperature effect induced by the piezoresistor. The temperature difference between the two cantilevers can reach 40°C at 10V operation because of their difference thermal capacitance. For the microcantilever of 125×65×0.75 μm, the offset voltage of the parallel microcantilever is 1.65 mV and the temperature drift is 0.01 mV/°C. An improved parallel microcantilever design is developed using the stripe pattern design on the immobilized layer and the signal conditioning circuit for temperature compensation in biosensors. Analyses and experiments show that the performance of a CMOS sensor chip can be significantly improved.
AB - Microcantilever with embedded piezoresistor has been applied to in-situ surface stress measurement of biochemical reaction, where parallel microcantilever design by using an active cantilever for biosensing and another reference cantilever for noise cancellation has previously been proposed. This paper shows that the measurement is sensitive to the temperature effect induced by the piezoresistor. The temperature difference between the two cantilevers can reach 40°C at 10V operation because of their difference thermal capacitance. For the microcantilever of 125×65×0.75 μm, the offset voltage of the parallel microcantilever is 1.65 mV and the temperature drift is 0.01 mV/°C. An improved parallel microcantilever design is developed using the stripe pattern design on the immobilized layer and the signal conditioning circuit for temperature compensation in biosensors. Analyses and experiments show that the performance of a CMOS sensor chip can be significantly improved.
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U2 - 10.1115/DETC2007-34454
DO - 10.1115/DETC2007-34454
M3 - Conference contribution
AN - SCOPUS:44849137455
SN - 0791848027
SN - 9780791848029
SN - 0791848043
SN - 9780791848043
T3 - 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
SP - 693
EP - 717
BT - 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
T2 - 19th Int. Conf. Design Theory and Methodology and 1st Int. Conf. Micro and Nano Systems, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007
Y2 - 4 September 2007 through 7 September 2007
ER -