Inserting blockage plates in a sputtering chamber is one of the methods to obtain better film-thickness uniformity on the substrate. Conventional blockage plates are flat, and they achieve moderate improvement on film uniformity but at a cost of seriously compromising the film deposition rate on the substrate. In this study, a numerical method is developed to calculate the optimized geometry of blockage plates. With the optimized plates in place, very high level of film uniformity can be achieved with only moderate reduction on the film deposition rate.
|Number of pages||11|
|Journal||Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao|
|Publication status||Published - 2011 Dec 1|
All Science Journal Classification (ASJC) codes
- Mechanical Engineering